Development of a Sn–Ag–Cu solder reinforced with Ni-coated carbon nanotubes
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Title
Development of a Sn–Ag–Cu solder reinforced with Ni-coated carbon nanotubes
Authors
Keywords
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Journal
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS
Volume 22, Issue 3, Pages 315-322
Publisher
Springer Nature
Online
2010-05-20
DOI
10.1007/s10854-010-0135-6
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