标题
Development of a Sn–Ag–Cu solder reinforced with Ni-coated carbon nanotubes
作者
关键词
-
出版物
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS
Volume 22, Issue 3, Pages 315-322
出版商
Springer Nature
发表日期
2010-05-20
DOI
10.1007/s10854-010-0135-6
参考文献
相关参考文献
注意：仅列出部分参考文献，下载原文获取全部文献信息。- Temperature Dependence of Creep and Hardness of Sn-Ag-Cu Lead-Free Solder
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- Influence of Intermetallic Properties on Reliability of Lead-Free Flip-Chip Solder Joints
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- Interfacial intermetallic growth and shear strength of lead-free composite solder joints
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- Effects of Trace Amounts of Rare Earth Additions on Microstructure and Properties of Sn-Bi-Based Solder Alloy
- (2008) Wenxing Dong et al. JOURNAL OF ELECTRONIC MATERIALS
- Effect of Carbon Nanotubes on the Shear Strength and Electrical Resistivity of a Lead-Free Solder
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- Spalling behavior of interfacial intermetallic compounds in Pb-free solder joints subjected to temperature cycling loading
- (2007) J.W. Ronnie Teo et al. ACTA MATERIALIA
- Carbon nanotube-reinforced aluminium strips
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- Intermediate decomposition of metastable Cu5Zn8 phase in the soldered Sn–Ag–Zn/Cu interface
- (2007) Y.C. Liu et al. JOURNAL OF ALLOYS AND COMPOUNDS
- Influence of single-wall carbon nanotube addition on the microstructural and tensile properties of Sn–Pb solder alloy
- (2007) K. Mohan Kumar et al. JOURNAL OF ALLOYS AND COMPOUNDS
- Effects of multiple reflows on intermetallic morphology and shear strength of SnAgCu–xNi composite solder joints on electrolytic Ni/Au metallized substrate
- (2007) Pei Yao et al. JOURNAL OF ALLOYS AND COMPOUNDS
- Single-wall carbon nanotube (SWCNT) functionalized Sn–Ag–Cu lead-free composite solders
- (2006) K. Mohan Kumar et al. JOURNAL OF ALLOYS AND COMPOUNDS
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