Liquid phase sintered Cu–In composite solders for thermal interface material and interconnect applications

Title
Liquid phase sintered Cu–In composite solders for thermal interface material and interconnect applications
Authors
Keywords
-
Journal
JOURNAL OF MATERIALS SCIENCE
Volume 46, Issue 21, Pages 7012-7025
Publisher
Springer Nature
Online
2011-06-18
DOI
10.1007/s10853-011-5670-x

Ask authors/readers for more resources

Find the ideal target journal for your manuscript

Explore over 38,000 international journals covering a vast array of academic fields.

Search

Create your own webinar

Interested in hosting your own webinar? Check the schedule and propose your idea to the Peeref Content Team.

Create Now