Correlation Between Surface Morphology Evolution and Grain Structure: Whisker/Hillock Formation in Sn-Cu

Correlating whisker growth and grain structure on Sn-Cu samples by real-time scanning electron microscopy and backscattering diffraction characterization

(2012) Fei Pei et al.   APPLIED PHYSICS LETTERS

Understanding the Correlation Between Intermetallic Growth, Stress Evolution, and Sn Whisker Nucleation

(2010) Nitin Jadhav et al.   IEEE TRANSACTIONS ON ELECTRONICS PACKAGING MANUFACTURING

Real-time SEM/FIB studies of whisker growth and surface modification

(2010) Nitin Jadhav et al.   JOM

A model of Sn whisker growth by coupled plastic flow and grain boundary diffusion

(2009) Eric J. Buchovecky et al.   APPLIED PHYSICS LETTERS

Local, submicron, strain gradients as the cause of Sn whisker growth

(2009) M. Sobiech et al.   APPLIED PHYSICS LETTERS

Dynamic Recrystallization (DRX) as the Mechanism for Sn Whisker Development. Part I: A Model

(2009) P. T. Vianco et al.   JOURNAL OF ELECTRONIC MATERIALS

Finite Element Modeling of Stress Evolution in Sn Films due to Growth of the Cu6Sn5 Intermetallic Compound

(2009) Eric Buchovecky et al.   JOURNAL OF ELECTRONIC MATERIALS

Stress behavior of electroplated Sn films during thermal cycling

(2009) Jae Wook Shin et al.   JOURNAL OF MATERIALS RESEARCH

Whisker formation in Sn and Pb–Sn coatings: Role of intermetallic growth, stress evolution, and plastic deformation processes

(2008) E. Chason et al.   APPLIED PHYSICS LETTERS

Plastic deformation processes in Cu/Sn bimetallic films

(2008) K.S. Kumar et al.   JOURNAL OF MATERIALS RESEARCH