Vacancies, twins, and the thermal stability of ultrafine-grained copper

Interfacial diffusion in a nanostructured Cu produced by means of dynamic plastic deformation

(2010) H.L. Wang et al.   ACTA MATERIALIA

A study of the interactive effects of strain, strain rate and temperature in severe plastic deformation of copper

(2009) Travis L. Brown et al.   ACTA MATERIALIA

Stabilizing nanostructured materials by coherent nanotwins and their grain boundary triple junction drag

(2009) C. Saldana et al.   APPLIED PHYSICS LETTERS

Strengthening Materials by Engineering Coherent Internal Boundaries at the Nanoscale

(2009) K. Lu et al.   SCIENCE

Effect of the Zener–Hollomon parameter on the microstructures and mechanical properties of Cu subjected to plastic deformation

(2008) Y LI et al.   ACTA MATERIALIA

Nanoscale growth twins in sputtered metal films

(2008) X. Zhang et al.   JOM

Thermal stability of sputtered Cu films with nanoscale growth twins

(2008) O. Anderoglu et al.   JOURNAL OF APPLIED PHYSICS

Stored energy and recrystallization temperature in high purity copper after equal channel angular pressing

(2008) Yue Zhang et al.   JOURNAL OF MATERIALS SCIENCE

Stored energy, vacancies and thermal stability of ultra-fine grained copper

(2008) W.Q. Cao et al.   MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING

Observation of Atomic Diffusion at Twin-Modified Grain Boundaries in Copper

(2008) K.-C. Chen et al.   SCIENCE

Enhanced fracture toughness of bulk nanocrystalline Cu with embedded nanoscale twins

(2008) E QIN et al.   SCRIPTA MATERIALIA

Microstructural stability during cyclic loading of multilayer copper/copper samples with nanoscale twinning

(2008) C.J. Shute et al.   SCRIPTA MATERIALIA