Printing solder droplets for micro devices packages using pneumatic drop-on-demand (DOD) technique

Published 2012 View Full Article

  1. Home
  2. Publications
  3. Publication Search
  4. Publication Details
Title
Printing solder droplets for micro devices packages using pneumatic drop-on-demand (DOD) technique
Authors
Keywords
-
Journal
JOURNAL OF MATERIALS PROCESSING TECHNOLOGY
Volume 212, Issue 10, Pages 2066-2073
Publisher
Elsevier BV
Online
2012-05-22
DOI
10.1016/j.jmatprotec.2012.05.007

Ask authors/readers for more resources

Protocol

Community support

Reagent

Community support

Reprint

Contact the author

Find the ideal target journal for your manuscript

Explore over 38,000 international journals covering a vast array of academic fields.

Search

Become a Peeref-certified reviewer

The Peeref Institute provides free reviewer training that teaches the core competencies of the academic peer review process.

Get Started
Webinars Posters Questions Hubs Funding Journals Articles Connect Collections Reviewers About Us FAQs Mobile App Privacy Policy Terms of Use
© Peeref 2019-2024. All rights reserved.