Printing solder droplets for micro devices packages using pneumatic drop-on-demand (DOD) technique

标题
Printing solder droplets for micro devices packages using pneumatic drop-on-demand (DOD) technique
作者
关键词
-
出版物
JOURNAL OF MATERIALS PROCESSING TECHNOLOGY
Volume 212, Issue 10, Pages 2066-2073
出版商
Elsevier BV
发表日期
2012-05-22
DOI
10.1016/j.jmatprotec.2012.05.007

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