3D Integrated Water Cooling of a Composite Multilayer Stack of Chips

Experimental Investigation of an Ultrathin Manifold Microchannel Heat Sink for Liquid-Cooled Chips

(2010) W. Escher et al.   JOURNAL OF HEAT TRANSFER-TRANSACTIONS OF THE ASME

Optimization of a stepped circular pin-fin array to enhance heat transfer performance

(2009) Kwang-Yong Kim et al.   HEAT AND MASS TRANSFER

Combined local microchannel-scale CFD modeling and global chip scale network modeling for electronics cooling design

(2009) R. Wälchli et al.   INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER

Correction to "Micro scale pin fin heat sinks: Parametric performance evaluation study"

(2008) Ali Koar et al.   IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES

Numerical study of pin-fin heat sink with un-uniform fin height design

(2008) Yue-Tzu Yang et al.   INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER

Efficiency of optimized bifurcating tree-like and parallel microchannel networks in the cooling of electronics

(2008) W. Escher et al.   INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER

Liquid Single-Phase Flow in an Array of Micro-Pin-Fins—Part I: Heat Transfer Characteristics

(2008) Weilin Qu et al.   JOURNAL OF HEAT TRANSFER-TRANSACTIONS OF THE ASME

Interlayer cooling potential in vertically integrated packages

(2008) T. Brunschwiler et al.   MICROSYSTEM TECHNOLOGIES-MICRO-AND NANOSYSTEMS-INFORMATION STORAGE AND PROCESSING SYSTEMS