Vacuum Packaging of MEMS by Self-Assembly

High fill-factor micromirror array using a self-aligned vertical comb drive actuator with two rotational axes

(2009) Minsoo Kim et al.   JOURNAL OF MICROMECHANICS AND MICROENGINEERING

Alternative approach in 3D MEMS-IC integration using fluidic self-assembly techniques

(2009) Y A Chapuis et al.   JOURNAL OF MICROMECHANICS AND MICROENGINEERING

Self-assembly from milli- to nanoscales: methods and applications

(2009) M Mastrangeli et al.   JOURNAL OF MICROMECHANICS AND MICROENGINEERING

Implementation of silicon-on-glass MEMS devices with embedded through-wafer silicon vias using the glass reflow process for wafer-level packaging and 3D chip integration

(2008) Chiung-Wen Lin et al.   JOURNAL OF MICROMECHANICS AND MICROENGINEERING

Development of a lateral velocity-controlled MEMS vibratory gyroscope and its performance test

(2008) Woon-Tahk Sung et al.   JOURNAL OF MICROMECHANICS AND MICROENGINEERING

Microscale self-assembly using molten alloys with different melting points

(2008) Christopher J. Morris et al.   JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B

Low temperature epoxy bonding for wafer level MEMS packaging

(2007) Yong-Kook Kim et al.   SENSORS AND ACTUATORS A-PHYSICAL