Application of a Taguchi Method Technique in Determining the Laminating Process Parameters for a Bonding Sheet

Title
Application of a Taguchi Method Technique in Determining the Laminating Process Parameters for a Bonding Sheet
Authors
Keywords
-
Journal
JOURNAL OF ELECTRONIC PACKAGING
Volume 132, Issue 4, Pages 041005
Publisher
ASME International
Online
2010-11-25
DOI
10.1115/1.4002723

Ask authors/readers for more resources

Discover Peeref hubs

Discuss science. Find collaborators. Network.

Join a conversation

Add your recorded webinar

Do you already have a recorded webinar? Grow your audience and get more views by easily listing your recording on Peeref.

Upload Now