Buckling and Delamination of Ti/Cu/Si Thin Film During Annealing

Title
Buckling and Delamination of Ti/Cu/Si Thin Film During Annealing
Authors
Keywords
Thin Film, interface reaction, buckling, delamination, microcracks
Journal
JOURNAL OF ELECTRONIC MATERIALS
Volume 43, Issue 9, Pages 3351-3356
Publisher
Springer Nature
Online
2014-06-03
DOI
10.1007/s11664-014-3238-7

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