Sn-Zn/Ni-Co Interfacial Reactions at 250°C

Effects of Minor Amounts of Zn on the Sn-Zn/Ni Interfacial Reactions and Phase Equilibria of the Ternary Sn-Zn-Ni System at 250°C

(2011) Chao-hong Wang et al.   JOURNAL OF ELECTRONIC MATERIALS

Interfacial reaction between Sn–3.0Ag–0.5Cu liquid solder and Ni–xZn novel UBM layers

(2011) Hsiu-Min Lin et al.   SURFACE & COATINGS TECHNOLOGY

Grain growth sequence of Cu3Sn in the Cu/Sn and Cu/Sn–Zn systems

(2010) M.Y. Tsai et al.   JOURNAL OF ALLOYS AND COMPOUNDS

Wettability and interfacial reactions between the molten Sn–3.0wt%Ag–0.5wt%Cu solder (SAC305) and Ni–Co alloys

(2010) Yue-ting Chen et al.   JOURNAL OF ALLOYS AND COMPOUNDS

Co Solubility in Sn and Interfacial Reactions in Sn-Co/Ni Couples

(2010) Sinn-wen Chen et al.   JOURNAL OF ELECTRONIC MATERIALS

Phase Equilibria in the Sn-Ni-Zn Ternary System: Isothermal Sections at 200°C, 500°C, and 800°C

(2010) Jaewon Chang et al.   JOURNAL OF ELECTRONIC MATERIALS

Study of the Effects of Zn Content on the Interfacial Reactions Between Sn-Zn Solders and Ni Substrates at 250°C

(2010) Chao-hong Wang et al.   JOURNAL OF ELECTRONIC MATERIALS

Interfacial reactions between Sn-Cu solders and Ni-Co alloys at 250 °C

(2010) Chih-Chi Chen et al.   JOURNAL OF MATERIALS RESEARCH

Effect of Bi addition on the activation energy for the growth of Cu5Zn8 intermetallic in the Sn–Zn lead-free solder

(2009) Ramani Mayappan et al.   INTERMETALLICS

Sn/Ni–Co solid/solid interfacial reactions

(2009) Chih-chi Chen et al.   INTERMETALLICS

Interfacial Reactions Between Sn-Zn Alloys and Ni Substrates

(2009) WenJun Zhu et al.   JOURNAL OF ELECTRONIC MATERIALS

Interfacial Reactions of Sn-9Zn-xCu (x = 1, 4, 7, 10) Solders with Ni Substrates

(2009) Wei-kai Liou et al.   JOURNAL OF ELECTRONIC MATERIALS

Deposition and characterization of electroless Ni–Co–P alloy for diffusion barrier applications

(2009) Anuj Kumar et al.   MICROELECTRONIC ENGINEERING

Phase equilibria of the Sn–Zn–Ag system and interfacial reactions in Sn–Zn/Ag couples

(2008) Chien-Chung Jao et al.   INTERMETALLICS

Phase equilibria of the Au–Sn–Zn ternary system and interfacial reactions in Sn–Zn/Au couples

(2008) Wei-kai Liou et al.   INTERMETALLICS

Effects of Electromigration on Interfacial Reactions in the Ni/Sn-Zn/Cu Solder Interconnect

(2008) X.F. Zhang et al.   JOURNAL OF ELECTRONIC MATERIALS

Effect of Cu Thickness on the Evolution of the Reaction Products at the Sn-9wt.%Zn Solder/Cu Interface During Reflow

(2008) Chih-hao Chen et al.   JOURNAL OF ELECTRONIC MATERIALS

Contact damage evolution in diamondlike carbon coatings on ductile substrates

(2008) Rajnish K. Singh et al.   JOURNAL OF MATERIALS RESEARCH

Investigation of Electroless Co(W,P) Thin Film as the Diffusion Barrier of Underbump Metallurgy

(2008) W. C. Wu et al.   JOURNAL OF THE ELECTROCHEMICAL SOCIETY

Phase Equilibria of Sn-Co-Ni System and Interfacial Reactions in Sn/(Co, Ni) Couples

(2008) Yi-Hsiang Chao et al.   METALLURGICAL AND MATERIALS TRANSACTIONS A-PHYSICAL METALLURGY AND MATERIALS SCIENCE

A study of nanoparticles in Sn–Ag based lead free solders

(2007) Masazumi Amagai   MICROELECTRONICS RELIABILITY