Wettability and interfacial reactions between the molten Sn–3.0wt%Ag–0.5wt%Cu solder (SAC305) and Ni–Co alloys

Title
Wettability and interfacial reactions between the molten Sn–3.0wt%Ag–0.5wt%Cu solder (SAC305) and Ni–Co alloys
Authors
Keywords
-
Journal
JOURNAL OF ALLOYS AND COMPOUNDS
Volume 507, Issue 2, Pages 419-424
Publisher
Elsevier BV
Online
2010-08-12
DOI
10.1016/j.jallcom.2010.08.006

Ask authors/readers for more resources

Find Funding. Review Successful Grants.

Explore over 25,000 new funding opportunities and over 6,000,000 successful grants.

Explore

Ask a Question. Answer a Question.

Quickly pose questions to the entire community. Debate answers and get clarity on the most important issues facing researchers.

Get Started