Mechanical Characterization of Lead-Free Sn-Ag-Cu Solder Joints by High-Temperature Nanoindentation

A review on the interfacial intermetallic compounds between Sn–Ag–Cu based solders and substrates

(2010) Guang Zeng et al.   JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS

Hot nanoindentation in inert environments

(2010) Jonathan C. Trenkle et al.   REVIEW OF SCIENTIFIC INSTRUMENTS

Mechanical properties of Cu6Sn5 intermetallic by micropillar compression testing

(2010) L. Jiang et al.   SCRIPTA MATERIALIA

Thermomechanical behaviour of environmentally benign Pb-free solders

(2009) N Chawla   INTERNATIONAL MATERIALS REVIEWS

Mechanical properties versus temperature relation of individual phases in Sn–3.0Ag–0.5Cu lead-free solder alloy

(2008) Feng Gao et al.   MICROELECTRONICS RELIABILITY

Nanoindentation identifications of mechanical properties of Cu6Sn5, Cu3Sn, and Ni3Sn4 intermetallic compounds derived by diffusion couples

(2007) Ping-Feng Yang et al.   MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING