Tin Whisker Growth on the Surface of Sn-0.7Cu Lead-Free Solder with a Rare Earth (Nd) Addition

Published 2009 View Full Article

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Title
Tin Whisker Growth on the Surface of Sn-0.7Cu Lead-Free Solder with a Rare Earth (Nd) Addition
Authors
Keywords
-
Journal
JOURNAL OF ELECTRONIC MATERIALS
Volume 38, Issue 11, Pages 2353-2361
Publisher
Springer Nature
Online
2009-08-26
DOI
10.1007/s11664-009-0926-9

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