Tin Whisker Growth on the Surface of Sn-0.7Cu Lead-Free Solder with a Rare Earth (Nd) Addition

标题
Tin Whisker Growth on the Surface of Sn-0.7Cu Lead-Free Solder with a Rare Earth (Nd) Addition
作者
关键词
-
出版物
JOURNAL OF ELECTRONIC MATERIALS
Volume 38, Issue 11, Pages 2353-2361
出版商
Springer Nature
发表日期
2009-08-26
DOI
10.1007/s11664-009-0926-9

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