Electroless nickel deposition of a palladium-activated self-assembled monolayer on polyester fabric

Polyelectrolyte-Bridged Metal/Cotton Hierarchical Structures for Highly Durable Conductive Yarns

(2010) Xuqing Liu et al.   ACS Applied Materials & Interfaces

Electroless nickel plating on APTHS modified wood veneer for EMI shielding

(2010) Haibing Liu et al.   APPLIED SURFACE SCIENCE

Ultrasonic-assisted electroless deposition of Ag on PET fabric with low silver content for EMI shielding

(2010) Yinxiang Lu et al.   SURFACE & COATINGS TECHNOLOGY

Surface functionalization of nanostructured silver-coated polyester fabric by magnetron sputtering

(2010) S.X. Jiang et al.   SURFACE & COATINGS TECHNOLOGY

Formation and characterization of low resistivity sub-100nm copper films deposited by electroless on SAM

(2009) T. Asher et al.   ELECTROCHIMICA ACTA

Influence of aminosilane surface functionalization of rare earth hydride-forming alloys on palladium treatment by electroless deposition and hydrogen sorption kinetics of composite materials

(2009) M. Williams et al.   MATERIALS CHEMISTRY AND PHYSICS

Electroless Ni–Mo–P diffusion barriers with Pd-activated self-assembled monolayer on SiO2

(2009) Dian-long Liu et al.   Materials Science and Engineering B-Advanced Functional Solid-State Materials

Gold coated para-aramid yarns through electroless deposition

(2009) Anne Schwarz et al.   SURFACE & COATINGS TECHNOLOGY

Electroless plating of copper on polyimide films modified by surface-initiated atom-transfer radical polymerization of 4-vinylpyridine

(2008) Liang Li et al.   APPLIED SURFACE SCIENCE

Effect of copper content on the properties of Ni–Cu–P plated polyester fabric

(2008) R. H. Guo et al.   JOURNAL OF APPLIED ELECTROCHEMISTRY

Microstructure and electromagnetic interference shielding effectiveness of electroless Ni–P plated polyester fabric

(2008) R. H. Guo et al.   JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS

Electroless Plating of Silicon Nitride Using (3-Aminopropyl) Triethoxysilane

(2008) Amir Holtzman et al.   JOURNAL OF THE ELECTROCHEMICAL SOCIETY

Conformal electroless deposition of Cu seed layer on a 60-nm trench pattern modified with a self-assembled monolayer

(2008) Won-Kyu Han et al.   MICROELECTRONIC ENGINEERING

Surface functionalization of porous ZrO2–TiO2 membranes using γ-aminopropyltriethoxysilane in palladium electroless deposition

(2007) M. Williams et al.   APPLIED SURFACE SCIENCE

Electroless nickel–phosphorus plating on SiCp/Al composite from acid bath with nickel activation

(2007) Libo Li et al.   JOURNAL OF ALLOYS AND COMPOUNDS