Influence of TiO2 nanoparticles on IMC growth in Sn–3.0Ag–0.5Cu–xTiO2 solder joints in reflow process

标题
Influence of TiO2 nanoparticles on IMC growth in Sn–3.0Ag–0.5Cu–xTiO2 solder joints in reflow process
作者
关键词
-
出版物
JOURNAL OF ALLOYS AND COMPOUNDS
Volume 554, Issue -, Pages 195-203
出版商
Elsevier BV
发表日期
2012-12-14
DOI
10.1016/j.jallcom.2012.12.019

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