Review of Recent Advances in Electrically Conductive Adhesive Materials and Technologies in Electronic Packaging

出版年份 2008 全文链接

标题

Review of Recent Advances in Electrically Conductive Adhesive Materials and Technologies in Electronic Packaging

作者

关键词

-

出版物

JOURNAL OF ADHESION SCIENCE AND TECHNOLOGY

Volume 22, Issue 14, Pages 1593-1630

出版商

Informa UK Limited

发表日期

2008-10-15

DOI

10.1163/156856108x320519

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