Improved Diffusion-Resistant Ability of Multicomponent Nitrides: From Unitary TiN to Senary High-Entropy (TiTaCrZrAlRu)N

Mechanical performance and nanoindenting deformation of (AlCrTaTiZr)NCy multi-component coatings co-sputtered with bias

(2012) Shao-Yi Lin et al.   SURFACE & COATINGS TECHNOLOGY

4-nm thick multilayer structure of multi-component (AlCrRuTaTiZr)Nx as robust diffusion barrier for Cu interconnects

(2011) Shou-Yi Chang et al.   JOURNAL OF ALLOYS AND COMPOUNDS

Microstructures and mechanical properties of multi-component (AlCrTaTiZr)NxCy nanocomposite coatings

(2011) Shou-Yi Chang et al.   THIN SOLID FILMS

Property improvement of Cu–Zr alloy films with ruthenium addition for Cu metallization

(2010) Ying Wang et al.   ACTA MATERIALIA

Ru incorporation on marked enhancement of diffusion resistance of multi-component alloy barrier layers

(2010) Shou-Yi Chang et al.   JOURNAL OF ALLOYS AND COMPOUNDS

Ultrathin (AlCrTaTiZr)N[sub x]/AlCrTaTiZr Bilayer Structures with High Diffusion Resistance for Cu Interconnects

(2010) Shou-Yi Chang et al.   JOURNAL OF THE ELECTROCHEMICAL SOCIETY

Ultrathin Ru–Ta–C Barriers for Cu Metallization

(2010) J. S. Fang et al.   JOURNAL OF THE ELECTROCHEMICAL SOCIETY

Mechanical properties, deformation behaviors and interface adhesion of (AlCrTaTiZr)Nx multi-component coatings

(2010) Shou-Yi Chang et al.   SURFACE & COATINGS TECHNOLOGY

Migration of species in a prototype diffusion barrier: Cu, O, and H in TiN

(2009) L. Tsetseris et al.   APPLIED PHYSICS LETTERS

10-nm-thick quinary (AlCrTaTiZr)N film as effective diffusion barrier for Cu interconnects at 900 °C

(2009) Shou-Yi Chang et al.   APPLIED PHYSICS LETTERS

Multiprincipal-Element AlCrTaTiZr-Nitride Nanocomposite Film of Extremely High Thermal Stability as Diffusion Barrier for Cu Metallization

(2009) Shou-Yi Chang et al.   JOURNAL OF THE ELECTROCHEMICAL SOCIETY

Acoustic vibrations of anisotropic nanoparticles

(2009) Lucien Saviot et al.   PHYSICAL REVIEW B

Atomic-scale mechanisms for diffusion of impurities in transition-metal nitrides

(2009) L. Tsetseris et al.   SURFACE & COATINGS TECHNOLOGY

Ru thin film grown on TaN by plasma enhanced atomic layer deposition

(2009) Qi Xie et al.   THIN SOLID FILMS

Ir∕TaN as a bilayer diffusion barrier for advanced Cu interconnects

(2008) L. C. Leu et al.   APPLIED PHYSICS LETTERS

A Bilayer Diffusion Barrier of ALD-Ru/ALD-TaCN for Direct Plating of Cu

(2008) Soo-Hyun Kim et al.   JOURNAL OF THE ELECTROCHEMICAL SOCIETY

Improvement on the Diffusion Barrier Performance of Reactively Sputtered Ru–N Film by Incorporation of Ta

(2008) Chun-Wei Chen et al.   JOURNAL OF THE ELECTROCHEMICAL SOCIETY

Failure Mechanism of 5 nm Thick Ta–Si–C Barrier Layers Against Cu Penetration at 750–800°C

(2008) Jau-Shiung Fang et al.   JOURNAL OF THE ELECTROCHEMICAL SOCIETY

Thermal stability of Ti/Mo and Ti/MoN nanostructures for barrier applications in Cu interconnects

(2008) Prodyut Majumder et al.   NANOTECHNOLOGY