Article
Engineering, Multidisciplinary
Tao Wei, Yun Liu, Minghao Li, Lei Zhu, Wenjie Yu, Zhongying Xue, Xing Wei
Summary: Double-sided polishing (DSP) is a crucial process for achieving super-flatness in 300-mm silicon wafers. This research investigated the influence of wafer original thickness and carrier thickness on variations in wafer-to-wafer thickness. The study found that the difference in thickness between the wafer and the carrier affects the pad deformation, which in turn changes the material removal rate and causes non-uniformity in the DSP process. Additionally, inconsistent original wafer thickness or carrier thickness can lead to platen shift, further impacting the wafer-to-wafer thickness uniformity.
PRECISION ENGINEERING-JOURNAL OF THE INTERNATIONAL SOCIETIES FOR PRECISION ENGINEERING AND NANOTECHNOLOGY
(2023)
Article
Automation & Control Systems
Yongchao Xu, Chen Lin, Qianting Wang, Charlesming Zheng, Youji Zhan, Bingsan Chen
Summary: A novel flexible polishing process using a rigid-flexible composite structure polishing plate has been developed for sapphire wafers, simultaneously achieving excellent surface shape accuracy and high surface topography quality. The polishing plate is fabricated by casting and curing soft and hard unsaturated resins in a ring structure. The overall stiffness of the polishing plate is improved and the removal selectivity is enhanced. Experimental and simulation results demonstrate that the surface roughness and topographical variations of sapphire wafers polished by the novel rigid-flexible composite structure polishing plate have been greatly improved.
INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY
(2022)
Article
Electrochemistry
Lianhuan Han, Hantao Xu, Matthew M. Sartin, Zhenjiang Hu, Xuesen Zhao, Yongzhi Cao, Yongda Yan, Jian-Jia Su, Dongping Zhan, Zhong-Qun Tian
Summary: Electrochemistry is shown to be a crucial tool in precision machining, with the ability to control the concentration distribution of electrogenerated etchant via pulse frequency. By utilizing a theoretical model and finite element analysis, researchers have successfully reduced the roughness of a GaAs workpiece from 700 nm to 5.1 nm through electrochemical polishing.
JOURNAL OF THE ELECTROCHEMICAL SOCIETY
(2021)
Article
Chemistry, Physical
Qiufa Luo, Jing Lu, Zige Tian, Feng Jiang
Summary: In this study, the interaction between diamond abrasives and the 6H-SiC wafer surface during ultra-precision polishing was analyzed through experiments and molecular dynamics simulations. It was found that controlling material removal uniformity and restricting abrasive cutting depth to tens of nanometers or less can achieve a smooth, scratch-free and almost damage-free wafer surface. These findings provide insights into the importance of controlling material removal uniformity in nanoscale manufacturing processes.
APPLIED SURFACE SCIENCE
(2021)
Article
Automation & Control Systems
Le Nam Quoc Huy, Le Ngoc Quynh Hoa, Chao-Chang A. Chen
Summary: This study investigates the challenges of copper CMP technique and develops a three-dimensional microstructural model for polishing pads. It also introduces a new calibration method for material removal rates. The findings provide valuable insights for developing CMP process models and advanced applications.
INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY
(2023)
Article
Engineering, Manufacturing
Mohsen Derakhshan-Samani, Abdolreza Rahimi
Summary: This research presents an improved design of the BEMRF tool for polishing borosilicate glass lenses. Through simulation and experimentation, it was found that the optimized fluid composition achieved a 59% improvement in surface roughness.
MATERIALS AND MANUFACTURING PROCESSES
(2023)
Article
Engineering, Multidisciplinary
R. Raveendra Nath, K. Hemachandra Reddy, C. Vijaya Bhaskar Reddy
Summary: The study introduces parallel streams in the Goswami cycle to improve performance, resulting in consistently higher output compared to the conventional cycle. The thermal efficiency and exergy efficiency of the modified cycle show different results compared to the Goswami cycle.
ALEXANDRIA ENGINEERING JOURNAL
(2022)
Article
Chemistry, Multidisciplinary
Lichen Zhao, Qiuyang Li, Cheng-Hung Hou, Shunde Li, Xiaoyu Yang, Jiang Wu, Siyang Zhang, Qin Hu, Yanju Wang, Yuzhuo Zhang, Yufeng Jiang, Shuang Jia, Jing-Jong Shyue, Thomas P. Russell, Qihuang Gong, Xiaoyong Hu, Rui Zhu
Summary: A simple chemical polishing strategy was reported to remove PbI2 crystals from the perovskite surface, decoupling the effects of excess PbI in perovskite solar cells. This strategy resulted in improved perovskite surface properties, leading to increased photovoltages and fill factors, as well as enhanced device stability.
JOURNAL OF THE AMERICAN CHEMICAL SOCIETY
(2022)
Article
Engineering, Manufacturing
Xu Yang, Xiaozhe Yang, Kentaro Kawai, Kenta Arima, Kazuya Yamamura
Summary: The study proposes a three-step silicon carbide wafer manufacturing process using slurryless electrochemical mechanical polishing, which can rapidly transform an unprocessed SiC wafer to an atomically smooth surface, thereby reducing the cost and manpower required during SiC wafer manufacturing.
JOURNAL OF MANUFACTURING PROCESSES
(2021)
Article
Engineering, Multidisciplinary
Bin Luo, Qiusheng Yan, Jingfu Chai, Wenqing Song, Jisheng Pan
Summary: Cluster magnetorheological finishing (MRF) is a novel ultra-smooth planarization method that optimizes the surface microstructures on polishing disks by simulating and controlling the behavior of Bingham fluids. The study found that surface microstructures can enhance polishing effects and reduce the wear of polishing disks. The polishing test results validated the effectiveness of the simulation model.
PRECISION ENGINEERING-JOURNAL OF THE INTERNATIONAL SOCIETIES FOR PRECISION ENGINEERING AND NANOTECHNOLOGY
(2022)
Article
Automation & Control Systems
Zhixiang Chen, Shunkai Han, Ming Feng, Hongyu Chen, Xianglei Zhang
Summary: The application of layer stacked clamping (LSC) method in polishing ultrathin sapphire wafer was studied. Different baseplates with varying materials, surface roughness, flatness, and thickness were investigated for their effect on the friction force and polishing performance. The LSC method showed higher efficiency and better surface quality than the traditional paraffin bonding method in the double-side polishing of ultrathin sapphire.
INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY
(2023)
Article
Engineering, Mechanical
Tan-Tai Do, Te-Hua Fang
Summary: This study employed molecular dynamics simulations to investigate the substrate removal methods in beta-SiC polishing. The vibration-coupled rolling motion was found to be the most effective, while the sliding motion showed significant improvement in atom removal. Additionally, increasing the number of asperities and the amplitude of vibration led to improved surface roughness.
TRIBOLOGY INTERNATIONAL
(2023)
Article
Chemistry, Analytical
Peng Li, Julong Yuan, Minghui Zhu, Jianxing Zhou, Binghai Lyu
Summary: In this study, shear rheological polishing was used to improve the polishing efficiency of 4H-SiC wafers by polishing the Si surface. The effects of four critical parameters (abrasive particle size, abrasive particle concentration, polishing speed, and polishing pressure) on the Si surface polishing were analyzed using the Taguchi method. The wear particle size had the most significant influence on the surface roughness, followed by polishing pressure and abrasive concentration.
Article
Chemistry, Analytical
Pengjie Zheng, Dewen Zhao, Xinchun Lu
Summary: As feature sizes decrease, the investigation of pad unevenness caused by pad conditioning and its influence on chemical mechanical polishing becomes necessary. A kinematic model is set up to predict pad wear profile caused by diamond disk conditioning and verified through experiments. Based on the obtained pad wear profile, a static model is established to investigate the influence of pad unevenness on pad-wafer contact stress.
Article
Engineering, Multidisciplinary
Urara Satake, Toshiyuki Enomoto
Summary: This study aims to understand the cause of convexity in the double-sided polishing (DSP) process and provide guiding principles for determining better DSP conditions. By studying the radial distribution of relative speed between the workpiece and polishing pads, an indicator is constructed to guide the determination of DSP conditions.
PRECISION ENGINEERING-JOURNAL OF THE INTERNATIONAL SOCIETIES FOR PRECISION ENGINEERING AND NANOTECHNOLOGY
(2022)
