Process-Machine Interaction (PMI) Modeling and Monitoring of Chemical Mechanical Planarization (CMP) Process Using Wireless Vibration Sensors

Nonlinear Sequential Bayesian Analysis-Based Decision Making for End-Point Detection of Chemical Mechanical Planarization (CMP) Processes

(2011) Zhenyu Kong et al.   IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING

Process Performance Prediction for Chemical Mechanical Planarization (CMP) by Integration of Nonlinear Bayesian Analysis and Statistical Modeling

(2010) Zhenyu Kong et al.   IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING

Forecasting the evolution of nonlinear and nonstationary systems using recurrence-based local Gaussian process models

(2010) Satish T. S. Bukkapatnam et al.   PHYSICAL REVIEW E

Nonlinear Dynamics Modeling of Correlated Functional Process Variables for Condition Monitoring in Chemical–Mechanical Planarization

(2009) Hui Wang et al.   IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING

Prediction of scratch generation in chemical mechanical planarization

(2008) A. Chandra et al.   CIRP ANNALS-MANUFACTURING TECHNOLOGY

Experimental dynamics characterization and monitoring of MRR in oxide chemical mechanical planarization (CMP) process

(2008) S. Bukkapatnam et al.   INTERNATIONAL JOURNAL OF MACHINE TOOLS & MANUFACTURE

Sensor-based modeling of slurry chemistry effects on the material removal rate (MRR) in copper-CMP process

(2008) U. Phatak et al.   INTERNATIONAL JOURNAL OF MACHINE TOOLS & MANUFACTURE

Tribological Behavior of Metal CMP and Detection of Process Abnormality

(2008) Yohei Yamada et al.   JOURNAL OF THE ELECTROCHEMICAL SOCIETY