High-Density 3-D Capacitors for Power Systems On-Chip: Evaluation of a Technology Based on Silicon Submicrometer Pore Arrays Formed by Electrochemical Etching

Title
High-Density 3-D Capacitors for Power Systems On-Chip: Evaluation of a Technology Based on Silicon Submicrometer Pore Arrays Formed by Electrochemical Etching
Authors
Keywords
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Journal
IEEE TRANSACTIONS ON POWER ELECTRONICS
Volume 28, Issue 9, Pages 4440-4448
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Online
2012-12-11
DOI
10.1109/tpel.2012.2233219

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