Microstructure and sound absorption of porous copper prepared by resin curing and foaming method

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Title
Microstructure and sound absorption of porous copper prepared by resin curing and foaming method
Authors
Keywords
Porous materials, Microstructure, Airflow resistivity, Sound absorption, Size distribution
Journal
MATERIALS LETTERS
Volume 139, Issue -, Pages 318-321
Publisher
Elsevier BV
Online
2014-11-01
DOI
10.1016/j.matlet.2014.09.084

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