Sn whiskers mitigation by refining grains of Cu substrate during the room temperature exposure

Published 2015 View Full Article

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Title
Sn whiskers mitigation by refining grains of Cu substrate during the room temperature exposure
Authors
Keywords
Electronic materials, Pb-free, Sn whiskers, Grain boundaries, Reliability
Journal
MATERIALS LETTERS
Volume 161, Issue -, Pages 201-204
Publisher
Elsevier BV
Online
2015-08-18
DOI
10.1016/j.matlet.2015.08.074

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