Effect of Lead-Free Soldering on Key Material Properties of FR-4 Printed Circuit Board Laminates

Published 2009 View Full Article

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Title
Effect of Lead-Free Soldering on Key Material Properties of FR-4 Printed Circuit Board Laminates
Authors
Keywords
-
Journal
IEEE TRANSACTIONS ON ELECTRONICS PACKAGING MANUFACTURING
Volume 32, Issue 4, Pages 272-280
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Online
2009-09-17
DOI
10.1109/tepm.2009.2029566

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