Effect of Lead-Free Soldering on Key Material Properties of FR-4 Printed Circuit Board Laminates

标题
Effect of Lead-Free Soldering on Key Material Properties of FR-4 Printed Circuit Board Laminates
作者
关键词
-
出版物
出版商
Institute of Electrical and Electronics Engineers (IEEE)
发表日期
2009-09-17
DOI
10.1109/tepm.2009.2029566

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