Analysis of Adhesion and Fracture Energy of Nano-Particle Silver in Electronics Packaging Applications

Published 2009 View Full Article

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Title
Analysis of Adhesion and Fracture Energy of Nano-Particle Silver in Electronics Packaging Applications
Authors
Keywords
-
Journal
IEEE TRANSACTIONS ON ADVANCED PACKAGING
Volume 33, Issue 1, Pages 48-57
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Online
2009-12-01
DOI
10.1109/tadvp.2009.2033809

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