IEEE TRANSACTIONS ON ADVANCED PACKAGING

Journal website Submission website

Note: The following journal information is for reference only. Please check the journal website for updated information prior to submission.

Journal Title

IEEE T ADV PACKAGING

ISSN / eISSN

1521-3323

Subject Area

N/A

CiteScore

CiteScore Ranking

Web of Science Core Collection

Science Citation Index Expanded (SCIE)	Social Sciences Citation Index (SSCI)
-	-

Country/Area of Publication

UNITED STATES

Publication Frequency

Quarterly

Open Access

Contact

IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC, 445 HOES LANE, PISCATAWAY, USA, NJ, 08855-4141

IEEE Components, Packaging, and Manufacturing Technology Society Information: (2011)

IEEE Components, Packaging, and Manufacturing Technology Society Information for authors: (2011)

A Thermal Simulation Process Based on Electrical Modeling for Complex Interconnect, Packaging, and 3DI Structures: (2011) Lijun Jiang, Chuan Xu, Barry J. Rubin, Alan J. Weger, Alina Deutsch, Howard Smith, Alain Caron, Kaustav Banerjee

Accurate Characterization of Broadband Multiconductor Transmission Lines for High-Speed Digital Systems: (2011) Joong-Ho Kim, Dan Oh, Woopoung Kim

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