Fabrication Processes for Embedding Thin Chips in Flat Flexible Substrates

Published 2009 View Full Article

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Title
Fabrication Processes for Embedding Thin Chips in Flat Flexible Substrates
Authors
Keywords
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Journal
IEEE TRANSACTIONS ON ADVANCED PACKAGING
Volume 32, Issue 1, Pages 77-83
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Online
2009-02-20
DOI
10.1109/tadvp.2008.2005838

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