Ultrasonic Bonding for MEMS Sealing and Packaging

Published 2009 View Full Article

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Title
Ultrasonic Bonding for MEMS Sealing and Packaging
Authors
Keywords
-
Journal
IEEE TRANSACTIONS ON ADVANCED PACKAGING
Volume 32, Issue 2, Pages 461-467
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Online
2009-03-20
DOI
10.1109/tadvp.2008.2009927

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