On Ultra-Fine Leak Detection of Hermetic Wafer Level Packages

Published 2008 View Full Article

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Title
On Ultra-Fine Leak Detection of Hermetic Wafer Level Packages
Authors
Keywords
-
Journal
IEEE TRANSACTIONS ON ADVANCED PACKAGING
Volume 31, Issue 1, Pages 14-21
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Online
2008-02-12
DOI
10.1109/tadvp.2007.906385

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