Flip-Chip Bonding Packaged THz Photodiode With Broadband High-Power Performance

Published 2014 View Full Article

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Title
Flip-Chip Bonding Packaged THz Photodiode With Broadband High-Power Performance
Authors
Keywords
-
Journal
IEEE PHOTONICS TECHNOLOGY LETTERS
Volume 26, Issue 24, Pages 2462-2464
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Online
2014-09-18
DOI
10.1109/lpt.2014.2358843

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