Flip-Chip Bonding Packaged THz Photodiode With Broadband High-Power Performance

标题
Flip-Chip Bonding Packaged THz Photodiode With Broadband High-Power Performance
作者
关键词
-
出版物
IEEE PHOTONICS TECHNOLOGY LETTERS
Volume 26, Issue 24, Pages 2462-2464
出版商
Institute of Electrical and Electronics Engineers (IEEE)
发表日期
2014-09-18
DOI
10.1109/lpt.2014.2358843

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