A Modular 1 mm$^{3}$ Die-Stacked Sensing Platform With Low Power I$^{2}$C Inter-Die Communication and Multi-Modal Energy Harvesting

Published 2012 View Full Article

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Title
A Modular 1 mm$^{3}$ Die-Stacked Sensing Platform With Low Power I$^{2}$C Inter-Die Communication and Multi-Modal Energy Harvesting
Authors
Keywords
-
Journal
IEEE JOURNAL OF SOLID-STATE CIRCUITS
Volume 48, Issue 1, Pages 229-243
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Online
2012-12-13
DOI
10.1109/jssc.2012.2221233
References
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