A Modular 1 mm$^{3}$ Die-Stacked Sensing Platform With Low Power I$^{2}$C Inter-Die Communication and Multi-Modal Energy Harvesting

出版年份 2012 全文链接

标题

作者

关键词

出版物

Volume 48, Issue 1, Pages 229-243

出版商

Institute of Electrical and Electronics Engineers (IEEE)

发表日期

2012-12-13

DOI

10.1109/jssc.2012.2221233

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