Journal
IEEE ELECTRON DEVICE LETTERS
Volume 39, Issue 9, Pages 1373-1376Publisher
IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
DOI: 10.1109/LED.2018.2862158
Keywords
H-diamond; MISFET; ICP-PEALD
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Funding
- Key Laboratory Fund [61428030103162803001]
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A high frequency hydrogen-terminated diamond metal-insulator-semiconductor field-effect transistor (MISFET) with extremely small source-drain distance of about 350 nm was realized by self-aligned process on (001)-oriented single crystal diamond substrate. To suppress the gate leakage current, a low temperature Al2O3 film was deposited as the gate insulator by inductance coupled plasma enhanced atomic layer deposition. A low ohmic contact resistance of 1.84 Omega.mm was measured by using transmission line method. The fabricated 100 nm gate length MISFET shows a high current density of 585 mA/mm and a high transconductance of 206 mS/mm. By minimizing the parasitic parameters of the device, a high current gain cut-off frequency f(T) of 70 GHz and maximum frequency of oscillation f(max) of 80 GHz have been realized.
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