Journal
IEEE ELECTRON DEVICE LETTERS
Volume 35, Issue 10, Pages 1004-1006Publisher
IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
DOI: 10.1109/LED.2014.2344439
Keywords
GaN; HEMT; trapping; dynamic R-ON; current collapse; temperature
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This letter reports an extensive analysis of the charge capture transients induced by OFF-state bias in double heterostructure AlGaN/GaN MIS-high electron mobility transistor grown on silicon substrate. The exposure to OFF-state bias induces a significant increase in the ON-resistance (R-on) of the devices. Thanks to time-resolved on-the-fly analysis of the trapping kinetics, we demonstrate the following relevant results: 1) R-on-increase is temperature-and field-dependent, hence can significantly limit the dynamic performance of the devices at relatively high-voltage and high temperature (100 degrees C-140 degrees C) operative conditions; 2) the comparison between OFF-state and back-gating stress indicates that the major contribution to the R-on-increase is due to the trapping of electrons in the buffer, and not at the surface; 3) the observed exponential kinetics suggests the involvement of point-defects, featuring thermally activated capture cross section; and 4) trapping-rate is correlated with buffer vertical leakage-current and is almost independent to gate-drain length.
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