4.6 Article

Thermal Sensing With Lithographically Patterned Bimetallic Thin-Film Thermocouples

Journal

IEEE ELECTRON DEVICE LETTERS
Volume 32, Issue 6, Pages 818-820

Publisher

IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
DOI: 10.1109/LED.2011.2136314

Keywords

Seebeck coefficient; thermal coefficient measurements; thermal sensing; thermocouple; thin-film devices

Funding

  1. Air Force Office of Scientific Research [FA9550-09-1-0237]
  2. National Science Foundation at the Materials Research Center of Northwestern University [DMR-0520513]
  3. National Science Foundation (NSF) [CNS-0546305]
  4. NSF-REU [CNS-0546305]

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A chromium-nickel thin-film thermocouple that is 50 nm thick is demonstrated on a semiconductor substrate as proof of concept for lithographically processed bimetallic on-chip temperature sensors. The Seebeck coefficient of the thin-film thermocouple is calibrated to be 10.37 mu V/degrees C, reproducibly smaller than the bulk literature value by a factor of 3.98. The batch reproducibility of this thin-film Seebeck coefficient is demonstrated. The linear Seebeck response up to 90 degrees C is calibrated with the help of a simple formula which accounts for the temperature variations of the reference thermocouple under large heat loads.

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