期刊
JOURNAL OF ELECTRONIC MATERIALS
卷 41, 期 2, 页码 362-374出版社
SPRINGER
DOI: 10.1007/s11664-011-1756-0
关键词
Pb-free solder; nucleation; growth; solidification temperature; microstructure; electron backscattered diffraction (EBSD)
资金
- US Department of Defense, SERDP
Near-eutectic Sn-Ag-Cu samples were produced in different sizes and geometries, with different solidification temperatures. The Sn grain morphologies of samples were characterized and found to be correlated with the sample solidification temperature; the lower the solidification temperature, the higher the degree of interlacing observed. These Sn grain morphologies were observed to be consistent with a simple model that envisions the nucleus in an undercooled Sn-Ag-Cu liquid to be Sn atoms clustered around a Ag atom in a hexagonal configuration that allows Sn to grow epitaxially on each of its surfaces. At intermediate degrees of undercooling, a mixed Sn grain morphology is observed, with the interlaced portion associated with the region closer to Sn nucleation in these samples.
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