Formation of Intermetallic Compounds Between Liquid Sn and Various CuNi x Metallizations

标题
Formation of Intermetallic Compounds Between Liquid Sn and Various CuNi x Metallizations
作者
关键词
-
出版物
JOURNAL OF ELECTRONIC MATERIALS
Volume 37, Issue 6, Pages 792-805
出版商
Springer Nature
发表日期
2008-03-14
DOI
10.1007/s11664-008-0411-x

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