The role of interactions between abrasive particles and the substrate surface in chemical-mechanical planarization of Si-face 6H-SiC

The pH-dependant attachment of ceria nanoparticles to silica using surface analytical techniques

(2015) K. Dawkins et al.   APPLIED SURFACE SCIENCE

Performance of colloidal silica and ceria based slurries on CMP of Si-face 6H-SiC substrates

(2015) Guomei Chen et al.   APPLIED SURFACE SCIENCE

Electro-chemical mechanical polishing of single-crystal SiC using CeO 2 slurry

(2015) Hui Deng et al.   ELECTROCHEMISTRY COMMUNICATIONS

Studying bubble–particle interactions by zeta potential distribution analysis

(2015) Chendi Wu et al.   JOURNAL OF COLLOID AND INTERFACE SCIENCE

Tailoring the surface properties of cerium oxide nanoabrasives through morphology control for glass CMP

(2015) Thadathil S. Sreeremya et al.   RSC Advances

XPS, UV–vis spectroscopy and AFM studies on removal mechanisms of Si-face SiC wafer chemical mechanical polishing (CMP)

(2014) Yan Zhou et al.   APPLIED SURFACE SCIENCE

Characterization of colloidal silica abrasives with different sizes and their chemical–mechanical polishing performance on 4H-SiC (0001)

(2014) Xiaolei Shi et al.   APPLIED SURFACE SCIENCE

Role of ionic strength in chemical mechanical polishing of silicon carbide using silica slurries

(2014) Uma Rames Krishna Lagudu et al.   COLLOIDS AND SURFACES A-PHYSICOCHEMICAL AND ENGINEERING ASPECTS

Direct determination of the local Hamaker constant of inorganic surfaces based on scanning force microscopy

(2014) Brad A. Krajina et al.   JOURNAL OF CHEMICAL PHYSICS

Chemical mechanical planarization (CMP) of on-axis Si-face SiC wafer using catalyst nanoparticles in slurry

(2014) Yan Zhou et al.   SURFACE & COATINGS TECHNOLOGY

Growth of 4H-SiC epilayers with low surface roughness and morphological defects density on 4° off-axis substrates

(2013) Lin Dong et al.   APPLIED SURFACE SCIENCE

Influence of adhesion of silica and ceria abrasive nanoparticles on Chemical–Mechanical Planarization of silica surfaces

(2011) D.O. Volkov et al.   APPLIED SURFACE SCIENCE

Plasma assisted polishing of single crystal SiC for obtaining atomically flat strain-free surface

(2011) K. Yamamura et al.   CIRP ANNALS-MANUFACTURING TECHNOLOGY

Research on Reaction Method of High Removal Rate Chemical Mechanical Polishing Slurry for 4H-SiC Substrate

(2011) Hiroshi Nitta et al.   JAPANESE JOURNAL OF APPLIED PHYSICS

On the Flocculation and Agglomeration of Ceria Dispersion

(2011) Chun Kong et al.   JOURNAL OF DISPERSION SCIENCE AND TECHNOLOGY

Effect of natural organic matter on cerium dioxide nanoparticles settling in model fresh water

(2010) Joris T.K. Quik et al.   CHEMOSPHERE

Reverse selectivity – High silicon nitride and low silicon dioxide removal rates using ceria abrasive-based dispersions

(2010) P.R. Veera Dandu et al.   JOURNAL OF COLLOID AND INTERFACE SCIENCE

The synthesis of silica and silica–ceria, core–shell nanoparticles in a water-in-oil (W/O) microemulsion composed of heptane and water with the binary surfactants AOT and NP-5

(2010) Sang-Ho Chung et al.   JOURNAL OF COLLOID AND INTERFACE SCIENCE

Preparation, characterization and oxide CMP performance of composite polystyrene-core ceria-shell abrasives

(2010) Yang Chen et al.   MICROELECTRONIC ENGINEERING

Mechanism of high selectivity in ceria based shallow trench isolation chemical mechanical polishing slurries

(2010) R. Manivannan et al.   THIN SOLID FILMS

Covalent Attachment of Organic Monolayers to Silicon Carbide Surfaces

(2008) Michel Rosso et al.   LANGMUIR