期刊
MATERIALS SCIENCE & ENGINEERING R-REPORTS
卷 82, 期 -, 页码 1-32出版社
ELSEVIER SCIENCE SA
DOI: 10.1016/j.mser.2014.06.001
关键词
Nano-particles; Lead-free solders; Creep; Intermetallic compounds
资金
- Natural Science Foundation of Jiangsu Province [BK2012144]
- Natural Science Foundation of the Higher Education Institutions of Jiangsu Province [12KJB460005]
- Jiangsu Normal University Foundation [11XLR16]
- Jiangsu University of Science and Technology: Provincial Key Lab of Advanced Welding Technology Foundation [JSAWS-11-03]
Composite lead-free solders, containing micro and nano particles, have been widely studied. Due to grain boundary drag or Zener drag, these particles can refrain the solder microstructure from coarsening in services, especially for Cu6Sn5, Ag3Sn intermetallic compounds and the beta-Sn phases. Due to dispersion hardening or dislocation drag, the mechanical properties of the composite solder alloys were enhanced significantly. Moreover, these particles can influence the rate of interfacial reactions, and some particles can transform into a layer of intermetallic compound. Wettability, creep resistance, and hardness properties were affected by these particles. A systematic review of the development of these lead-free composite solders is given here, which hopefully may find applications in microbumps to be used in the future 3D IC technology. Published by Elsevier B.V.
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