Advances in Pb-free Solder Microstructure Control and Interconnect Design

Au–Sn bonding material for the assembly of power integrated circuit module

(2016) Z.X. Zhu et al.   JOURNAL OF ALLOYS AND COMPOUNDS

Heterogeneous nucleation of Cu 6 Sn 5 in Sn–Cu–Al solders

(2015) J.W. Xian et al.   JOURNAL OF ALLOYS AND COMPOUNDS

Controlling Bulk Cu6Sn5 Nucleation in Sn0.7Cu/Cu Joints with Al Micro-alloying

(2015) J. W. Xian et al.   JOURNAL OF ELECTRONIC MATERIALS

Nucleation and Growth of Cu-Al Intermetallics in Al-Modified Sn-Cu and Sn-Ag-Cu Lead-Free Solder Alloys

(2015) Kathlene N. Reeve et al.   JOURNAL OF ELECTRONIC MATERIALS

The Contribution of Constitutional Supercooling to Nucleation and Grain Formation

(2015) D. H. StJohn et al.   METALLURGICAL AND MATERIALS TRANSACTIONS A-PHYSICAL METALLURGY AND MATERIALS SCIENCE

Effect of Ni content on the diffusion-controlled growth of the product phases in the Cu(Ni)–Sn system

(2015) Varun A. Baheti et al.   PHILOSOPHICAL MAGAZINE

Heterogeneous nucleation of βSn on NiSn4, PdSn4 and PtSn4

(2014) S.A. Belyakov et al.   ACTA MATERIALIA

Effect of Ni on phase stability and thermal expansion of Cu6−xNixSn5 (X = 0, 0.5, 1, 1.5 and 2)

(2012) K. Nogita et al.   INTERMETALLICS

Reliability of Au-Ge and Au-Si Eutectic Solder Alloys for High-Temperature Electronics

(2012) Vivek Chidambaram et al.   JOURNAL OF ELECTRONIC MATERIALS

Development of Sn-Ag-Cu-X Solders for Electronic Assembly by Micro-Alloying with Al

(2012) Adam J. Boesenberg et al.   JOURNAL OF ELECTRONIC MATERIALS

Diffusion couple studies of the Ni-Bi-Sn system

(2012) G. Vassilev et al.   Journal of Mining and Metallurgy Section B-Metallurgy

Diffusion bonding of commercially pure Ni using Cu interlayer

(2012) A.H.M.E. Rahman et al.   MATERIALS CHARACTERIZATION

Development of high-temperature solders: Review

(2012) Guang Zeng et al.   MICROELECTRONICS RELIABILITY

Influence of Bonding Parameters on the Interaction Between Cu and Noneutectic Sn-In Solder Thin Films

(2011) Wardhana A. Sasangka et al.   JOURNAL OF ELECTRONIC MATERIALS

Sn–In–Ag phase equilibria and Sn–In–(Ag)/Ag interfacial reactions

(2011) Sinn-wen Chen et al.   MATERIALS CHEMISTRY AND PHYSICS

The orientation relationship between Ni and Cu6Sn5 formed during the soldering reaction

(2011) W.M. Chen et al.   SCRIPTA MATERIALIA

Die Attach Materials for High Temperature Applications: A Review

(2011) V R Manikam et al.   IEEE Transactions on Components Packaging and Manufacturing Technology

Cyclic twin nucleation in tin-based solder alloys

(2010) L.P. Lehman et al.   ACTA MATERIALIA

The influence of solder composition on the impact strength of lead-free solder ball grid array joints

(2010) H. Tsukamoto et al.   MICROELECTRONICS RELIABILITY

Stabilisation of Cu6Sn5 by Ni in Sn-0.7Cu-0.05Ni lead-free solder alloys

(2009) Kazuhiro Nogita   INTERMETALLICS

Interfacial Reactions of Si Die Attachment with Zn-Sn and Au-20Sn High Temperature Lead-Free Solders on Cu Substrates

(2009) Seongjun Kim et al.   JOURNAL OF ELECTRONIC MATERIALS

Nucleation Control and Thermal Aging Resistance of Near-Eutectic Sn-Ag-Cu-X Solder Joints by Alloy Design

(2009) Iver E. Anderson et al.   JOURNAL OF ELECTRONIC MATERIALS

Influence of Sn Grain Size and Orientation on the Thermomechanical Response and Reliability of Pb-free Solder Joints

(2008) T.R. Bieler et al.   IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES

Formation of Intermetallic Compounds Between Liquid Sn and Various CuNi x Metallizations

(2008) V. Vuorinen et al.   JOURNAL OF ELECTRONIC MATERIALS

Alloying modification of Sn–Ag–Cu solders by manganese and titanium

(2008) Li-Wei Lin et al.   MICROELECTRONICS RELIABILITY

Nickel-stabilized hexagonal (Cu,Ni)6Sn5 in Sn–Cu–Ni lead-free solder alloys

(2008) Kazuhiro Nogita et al.   SCRIPTA MATERIALIA