Review
Chemistry, Physical
Mohd Izrul Izwan Ramli, Mohd Arif Anuar Mohd Salleh, Mohd Mustafa Al Bakri Abdullah, Nur Syahirah Mohamad Zaimi, Andrei Victor Sandu, Petrica Vizureanu, Adam Rylski, Siti Farahnabilah Muhd Amli
Summary: This paper reviews the formation and growth of intermetallic compounds (IMCs) in lead-free solder joints, discussing the effects of alloying additions, surface finishes, aging time, aging temperature, and solder volume. Understanding the impact of these factors on IMC formation and growth can improve the reliability of solder joints.
Article
Engineering, Manufacturing
Rizk Mostala Shalaby, Musaeed Allzeleh
Summary: This study investigates the impact of intermetallic compound on the microstructure, mechanical properties and thermal behavior of Bi-Ag high-temperature lead-free solder. The results show that the addition of a small amount of silver can refine the grain size, decrease the melting temperature, and improve the hardness of the solder. Therefore, Bi-Ag lead-free solder alloys are recommended for high-temperature applications.
SOLDERING & SURFACE MOUNT TECHNOLOGY
(2023)
Article
Chemistry, Physical
Qiyuan Zhou, Fudong Zhang, Qizhen Chai, Yan He, Zhanhui Peng, Di Wu, Pengfei Liang, Lingling Wei, Juanjuan Wang, Xiaolian Chao, Zupei Yang
Summary: This study focuses on improving the temperature stability of lead-free Bi0.5Na0.5TiO3 (BNT) ceramics by adding CaSnO3 (CS), which resulted in an excellent temperature stability and low dielectric loss for the optimal composition BNT-0.15CS.
JOURNAL OF ALLOYS AND COMPOUNDS
(2023)
Article
Engineering, Electrical & Electronic
Zeyu Yuan, Yujie He, Ruize Wu, Ming Xu, Jun Zhang, Yunqing Zhu, Qiaoli Wang, Weibin Xie, Huiming Chen
Summary: In this study, the addition of trace amount of rare earth Tb in Sn-3.5Ag-0.5Cu solder was found to delay the formation of IMCs and result in thinner IMC layers. The addition of 0.025 wt% Tb improved shear strength and wettability, while slowing down IMC growth, thus extending the reliability of the joint interface and the service life of the solder joint.
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS
(2022)
Article
Engineering, Environmental
Shiyu Zhou, Yongping Pu, Xuqing Zhang, Yu Shi, Ziyan Gao, Yu Feng, Guodong Shen, Xueyun Wang, Dawei Wang
Summary: This study successfully introduced the high entropy compound BZMASZ into the BT-NBT matrix to improve the energy storage performance of ceramics. The 0.1 BZMASZ modified ceramics exhibited excellent energy density, conversion efficiency, and temperature stability after phase transition and enhancement of relaxor behavior.
CHEMICAL ENGINEERING JOURNAL
(2022)
Article
Engineering, Mechanical
Xu Long, Tianxiong Su, Changheng Lu, Shaobin Wang, Jiaqiang Huang, Chao Chang
Summary: This paper investigates the mechanical properties of Sn-3.0Ag-0.5Cu (SAC305) solder material under high strain rate and high temperature conditions. The dynamic response of the solder material at different strain rates and temperatures is studied by combining high strain rate experiments and a heating furnace. It is found that the maximum stress of the solder material initially increases and then decreases, accompanied by changes in the microstructure. Based on the experimental results, an improved Johnson-Cook model is proposed for numerical evaluations of packaging structures under extremely high strain rate conditions.
INTERNATIONAL JOURNAL OF IMPACT ENGINEERING
(2023)
Review
Materials Science, Multidisciplinary
T. T. Dele-Afolabi, M. N. M. Ansari, M. A. Azmah Hanim, A. A. Oyekanmi, O. J. Ojo-Kupoluyi, A. Atiqah
Summary: The rapid miniaturization of electronic products and expansion of application areas pose challenges to the electronic industry, particularly the reliability of electronic packaging materials. This article reviews recent developments in the investigation of Sn-based solder joint reliability and explores the influence of interlayer materials, ENImAg surface finish, geopolymer ceramics, and RMF technology.
JOURNAL OF MATERIALS RESEARCH AND TECHNOLOGY-JMR&T
(2023)
Review
Materials Science, Multidisciplinary
T. T. Dele-Afolabi, M. N. M. Ansari, M. A. Azmah Hanim, A. A. Oyekanmi, O. J. Ojo-Kupoluyi, A. Atiqah
Summary: The reliability of electronic packaging materials is crucial in the face of the rapid miniaturization of electronic products. This article reviews the recent developments on the reliability investigation of Sn-based solder joints and discusses various factors that influence solder joint reliability, including interlayer materials, ENImAg surface finish, geopolymer ceramics, and RMF technology. Promising advancements include the use of porous interlayer metals and ENImAg surface finish, which have proven to enhance lead-free solders.
JOURNAL OF MATERIALS RESEARCH AND TECHNOLOGY-JMR&T
(2023)
Article
Materials Science, Ceramics
Salman Ali Khan, Tauseef Ahmed, Jihee Bae, Soo Yong Choi, Mingyu Kim, Rizwan Ahmed Malik, Tae-Kwon Song, Myong-Ho Kim, Soonil Lee
Summary: By adding BNSTNZ modification, the dielectric permittivity of BFBT-BNSTNZ ceramics can be suppressed and the temperature stability range can be expanded. In particular, at x = 0.10, it has the widest stability temperature range and high dielectric permittivity with low dielectric loss.
JOURNAL OF THE EUROPEAN CERAMIC SOCIETY
(2022)
Article
Engineering, Multidisciplinary
Peng Shi, Xiaopei Zhu, Xiaojie Lou, Bian Yang, Xudong Guo, Liqiang He, Qida Liu, Sen Yang, Xiaoxiao Zhang
Summary: Lead-free ceramics were prepared with high energy storage performance, exhibiting excellent performance under high electric fields, especially remaining outstanding properties in high-temperature environments.
COMPOSITES PART B-ENGINEERING
(2021)
Article
Engineering, Environmental
Wenjing Qiao, Zhizhi Xu, Weizhi Yuan, Junbo Xu, Yangfei Gao, Mei Bai, Xiaopei Zhu, Yanhua Hu, Xiaojie Lou
Summary: The high entropy strategy has been proposed to improve the energy storage characteristics of perovskite dielectric capacitors. By increasing the configurational entropy and delaying polarization saturation, the strategy has achieved ultra-high recoverable energy storage density and high efficiency. The inclusion of Ba(5 M)O high entropy oxides has resulted in improved polarization characteristics, increased breakdown field, and enhanced energy storage density and efficiency. Furthermore, the high entropy strategy has demonstrated excellent thermal stability, frequency stability, and fatigue endurance.
CHEMICAL ENGINEERING JOURNAL
(2023)
Article
Chemistry, Physical
Zehua Jiang, Zhengyi Yang, Ying Yuan, Bin Tang, Shuren Zhang
Summary: Perovskite ceramic materials with a BNBST-xNN composition were fabricated using a solid-state reaction method. The addition of NaNbO3 suppressed grain growth and enhanced relaxor characteristics and dielectric temperature stability. The BNBST-0.1NN solid solution exhibited high recoverable energy storage density, excellent fatigue characteristics, and superior thermal stability of permittivity.
JOURNAL OF ALLOYS AND COMPOUNDS
(2021)
Article
Engineering, Electrical & Electronic
Yu-Chun Li, Ching-Hsun Chang, Alberto S. Pasana, Hsien-Ming Hsiao, Yee-Wen Yen
Summary: The interfacial reactions between lead-free solders Sn, Sn-3.0 wt.% Ag-0.5 wt.% Cu (SAC) and Sn-9 wt.% Zn (SZ), and Cu-2.0 wt.% Be (Alloy 25) were investigated using the liquid/solid couple technique. Different intermetallic compounds were observed at the interfaces under different reaction conditions, with the thickness following a parabolic law and growth mechanism being diffusion-controlled.
JOURNAL OF ELECTRONIC MATERIALS
(2021)
Article
Multidisciplinary Sciences
Zhiwei Fu, Qinru Wei, Xiaotong Guo, Xing Fu, Jian Wang, Chao Yang, Huaixin Guo, Jia-Yue Yang
Summary: A numerical analysis is used to establish kinetic models for Cu flux on Cu/Sn/Cu, and these models are verified with reported data. The models discuss the polarity effect of intermetallic compounds (IMCs) growth at different alloying stages. It is found that the net thermodiffusion Cu flux in Cu6Sn5 is over three times larger than that in Cu3Sn before Sn solder is depleted. With current stressing, the thickness of IMCs increases from parabola-like curves to a linear-like relationship.
ADVANCED THEORY AND SIMULATIONS
(2023)
Review
Materials Science, Multidisciplinary
Muhammad Nasir Bashir, Sajid Ullah Butt, Muhammad Adil Mansoor, Niaz Bahadur Khan, Shahid Bashir, Yew Hoong Wong, Turki Alamro, Sayed Mohamed Eldin, Mohammed Jameel
Summary: Due to the miniaturization of electronic devices, electromigration has become a serious reliability issue in lead-free solder joints. The orientation of the beta-Sn grain plays a crucial role in electromigration failures, and numerous studies have been conducted to investigate its influence.
Article
Chemistry, Physical
Yu-An Shen, Han-Ming Hsieh, Shih-Hsun Chen, Jiahui Li, Sheng-Wen Chen, Hiroshi Nishikawa
Summary: This study examined the potential application of high-entropy alloy FeCoNiCu (FCNC) in electronic packaging, addressing its microstructure, thermal stability, corrosion behavior, and wettability towards solder. The findings show that FCNC has excellent thermal stability, corrosion resistance, and good wettability towards SAC305 solder, suggesting possible applications in HEA-related fields and electronic packaging.
APPLIED SURFACE SCIENCE
(2021)
Article
Nanoscience & Nanotechnology
Junko Umeda, Takayuki Tanaka, Takuma Teramae, Shota Kariya, Junji Fujita, Hiroshi Nishikawa, Yoji Shibutani, Jianghua Shen, Katsuyoshi Kondoh
Summary: In this study, Ti-Fe alloys were fabricated using Fe as a beta-phase stabilizer via powder metallurgy. The addition of Fe resulted in increased beta-Ti volume fraction and refined alpha-Ti grains, leading to significant improvements in tensile strength and ductility. The dominant strengthening factors for these alloys were alpha-Ti grain refinement and beta-Ti hard phase dispersion, with 50% of the yield stress increase attributable to the latter mechanism in the case of 4 wt% Fe addition.
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING
(2021)
Article
Materials Science, Multidisciplinary
Zhi Jin, Yu-An Shen, Fupeng Huo, Y. C. Chan, Hiroshi Nishikawa
Summary: The study investigated the electromigration effect of pure silver thin films, observed a new phenomenon, and proposed a method to improve reliability.
JOURNAL OF MATERIALS SCIENCE
(2021)
Article
Engineering, Electrical & Electronic
Juncai Hou, Qiumei Zhang, Siliang He, Jingru Bian, Jinting Jiu, Chengxin Li, Hiroshi Nishikawa
Summary: A novel method based on cold spray deposition and subsequent oxidation-reduction process was proposed to achieve solid-state Cu-Cu joint with cheap micro-sized Cu particles at low temperature. The Cu2O nanoparticles formed on the surface of Cu particles with the oxidation were completely reduced to metal Cu nanoparticles, resulting in a Cu-Cu joint with a shear strength of 32.9 MPa. Furthermore, the stronger interfacial bonding between cold spray deposit and Cu substrate led to a ductile fracture feature in joint fracture, which could improve the reliability of Cu-Cu joint.
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS
(2021)
Article
Chemistry, Applied
Byungho Park, Duy Le Han, Mikiko Saito, Jun Mizuno, Hiroshi Nishikawa
Summary: The study found that the annealing conditions of the Mn-Cu precursor sheets significantly influenced the final nanoporous structure of copper. Precursors annealed at lower temperatures resulted in a more refined nanoporous structure.
JOURNAL OF POROUS MATERIALS
(2021)
Article
Materials Science, Multidisciplinary
Fupeng Huo, Yu-An Shen, Siliang He, Keke Zhang, Hiroshi Nishikawa
Summary: This study introduced a new method for the synthesis of NiO/ZrO2 nanocomposites and explored the formation mechanism. It was found that the attachment of NiO on ZrO2 could be regulated by controlling the ball milling time and Ni/Zr molar ratios. In-situ TEM observations revealed the reaction process and the transformation of precursor into NiO.
Article
Materials Science, Multidisciplinary
Hiroshi Nishikawa, Yuki Hirata, Chih-han Yang, Shih-kang Lin
Summary: This study investigates the effects of adding Zn and In to Sn-45Bi alloy on the interface and shear strengths of Cu/Cu joints. The results show that the addition of Zn and In eliminates the coarsening of Bi near the interface of the joints. Furthermore, the SBZI alloy demonstrates the highest long-term reliability among all the joints examined.
Article
Materials Science, Multidisciplinary
Shao-Yu Hsu, Chih-Ming Chen, Jenn-Ming Song, Hiroshi Nishikawa
Summary: In this study, Cu-Sn TLP bonding is investigated and two IMCs are formed at the bonding interface. Additionally, it is found that Cu bases with special topographical surface structures can improve the shear strength of TLP bonding.
MATERIALS CHEMISTRY AND PHYSICS
(2022)
Article
Materials Science, Multidisciplinary
Jianhao Wang, Songbai Xue, Lu Liu, Peng Zhang, Hiroshi Nishikawa
Summary: This study investigated the three-dimensional interfacial morphology and properties of eutectic SnPb solder joint under extreme thermal shocking conditions of 77-423 K to meet the cryogenic reliability requirements of electronic packaging for deep space satellites. The results showed that after thermal shocking, the Cu-Sn IMC layers coarsened and micro-cracks formed in the Cu6Sn5 layer. The rough Cu6Sn5 layer gradually smoothed in the top view, with broken Cu6Sn5 particles and exposed Cu3Sn. In the bottom-view observation, the Cu6Sn5 layer of the as-soldered joint was overlapped by the Cu3Sn layer. However, no defects were generated in the Cu3Sn layer. The shear force of the solder joint was greatly reduced due to the broken Cu6Sn5, with the fracture characteristics shifting from solder-controlled mode to solder/IMC mixed mode.
SCIENCE AND TECHNOLOGY OF WELDING AND JOINING
(2022)
Article
Materials Science, Multidisciplinary
Duy Le Han, Yu-An Shen, Fupeng Huo, Hiroshi Nishikawa
Summary: This study analyzes the effect of the addition of xCu on the In-Sn-xCu/Cu joint. The results show that adding a certain amount of Cu can improve the wettability of the joint and increase the contact angle, but excessive Cu can lead to the formation of voids and rough interfacial IMC layer, thereby reducing the shear strength of the joint.
Article
Materials Science, Multidisciplinary
Fupeng Huo, Zhi Jin, Duy Le Han, Keke Zhang, Hiroshi Nishikawa
Summary: By modifying the surface of T-ZnOw with NiO nanoparticles and preparing a composite solder, an interface structure of Sn1.0Ag0.5Cu/NiO/T-ZnOw with high strength and ductility was achieved.
MATERIALS & DESIGN
(2021)
Article
Materials Science, Multidisciplinary
Chin-Hao Tsai, Wei-Chen Huang, Ly May Chew, Wolfgang Schmitt, Jiahui Li, Hiroshi Nishikawa, C. R. Kao
Summary: In this study, a novel micro-silver paste was used to address the limitations of traditional nano-silver paste for sintering processes. By adding indium to the micro-silver paste, Ag-In intermetallic compounds and Ag-In solid solution phases were formed, effectively resolving oxidation issues and enhancing high-temperature reliability. The Ag-In IMCs also exhibited excellent mechanical properties, withstanding thermal stress during thermal cycling tests.
JOURNAL OF MATERIALS RESEARCH AND TECHNOLOGY-JMR&T
(2021)
Article
Materials Science, Multidisciplinary
Yong-Jae Kim, Byung-Ho Park, Soong-Keun Hyun, Hiroshi Nishikawa
Summary: The thermal conductivity of a silver sintered joint increases with higher sintering temperatures, while the porosity decreases. Factors such as pore size and shape also influence thermal conductivity.
MATERIALS TODAY COMMUNICATIONS
(2021)
Article
Engineering, Chemical
Jhih-Jhu Jhan, Kazutoshi Wataya, Hiroshi Nishikawa, Chih-Ming Chen
Summary: In this study, nanocrystalline Cu was constructed on the bonding surfaces using electrodeposition and direct bonding was carried out in a formic acid atmosphere. The results showed that a well-bonded Cu-Cu joint with a high shear strength of 71 MPa can be achieved by direct bonding of two Cu surfaces with a nanocrystalline structure. Microstructural analysis revealed significant grain growth accompanying the formation of twins at the bonding interface, contributing to the high bonding strength.
JOURNAL OF THE TAIWAN INSTITUTE OF CHEMICAL ENGINEERS
(2022)
Article
Materials Science, Multidisciplinary
Jianhao Wang, Xunda Liu, Fupeng Huo, Kento Kariya, Noriyuki Masago, Hiroshi Nishikawa
Summary: A novel TLP bonding method using In-coated Cu sheet was designed for high-temperature die attach, showing significant improvement in the mechanical properties of joints bonded under different parameters, although the brittle characteristics and location of the fracture remained almost unchanged for the different bonding parameters.
MATERIALS RESEARCH BULLETIN
(2022)
