Microstructure evolution and mechanical reliability of Cu/Au–Sn/Cu joints during transient liquid phase bonding
出版年份 2018 全文链接
标题
Microstructure evolution and mechanical reliability of Cu/Au–Sn/Cu joints during transient liquid phase bonding
作者
关键词
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出版物
JOURNAL OF MATERIALS SCIENCE
Volume 53, Issue 12, Pages 9287-9296
出版商
Springer Nature
发表日期
2018-03-09
DOI
10.1007/s10853-018-2204-9
参考文献
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注意:仅列出部分参考文献,下载原文获取全部文献信息。- Study on the microstructure and mechanical properties of Cu-Sn intermetallic joints rapidly formed by ultrasonic-assisted transient liquid phase soldering
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