标题
Origin and evolution of a crack in silicon induced by a single grain grinding
作者
关键词
Crack, Si, Molecular dynamics, TEM, Median
出版物
Journal of Manufacturing Processes
Volume 75, Issue -, Pages 617-626
出版商
Elsevier BV
发表日期
2022-01-25
DOI
10.1016/j.jmapro.2022.01.037
参考文献
相关参考文献
注意：仅列出部分参考文献，下载原文获取全部文献信息。- Processing outcomes of atomic force microscope tip-based nanomilling with different trajectories on single-crystal silicon
- (2021) Jiqiang Wang et al. PRECISION ENGINEERING-JOURNAL OF THE INTERNATIONAL SOCIETIES FOR PRECISION ENGINEERING AND NANOTECHNOLOGY
- An experimental study on atomic-level unified criterion for brittle fracture
- (2020) Kai Huang et al. INTERNATIONAL JOURNAL OF SOLIDS AND STRUCTURES
- Numerical and experimental investigation on ductile deformation and subsurface defects of monocrystalline silicon during nano-scratching
- (2020) Bing Liu et al. APPLIED SURFACE SCIENCE
- Two-dimensional detection of subsurface damage in silicon wafers with polarized laser scattering
- (2020) Jingfei Yin et al. JOURNAL OF MATERIALS PROCESSING TECHNOLOGY
- Micromechanics of Machining and Wear in Hard and Brittle Materials
- (2020) Brian R Lawn et al. JOURNAL OF THE AMERICAN CERAMIC SOCIETY
- Dynamic crack modeling and analytical stress field analysis in single-crystal silicon using quantitative fractography
- (2020) Anthony Moulins et al. THEORETICAL AND APPLIED FRACTURE MECHANICS
- Evolution of nano-cracks in single-crystal silicon during ultraprecision mechanical polishing
- (2020) Houfu Dai et al. Journal of Manufacturing Processes
- Molecular dynamics simulation of the combination effect of the tip inclination and scratching direction on nanomachining of single crystal silicon
- (2020) Yongda Yan et al. COMPUTATIONAL MATERIALS SCIENCE
- Anisotropic Fracture Dynamics Due to Local Lattice Distortions
- (2019) Gang Seob Jung et al. ACS Nano
- Graphene and two-dimensional materials for silicon technology
- (2019) Deji Akinwande et al. NATURE
- Velocity correlated crack front and surface marks in single crystalline silicon
- (2018) Lv Zhao et al. Nature Communications
- Ultraprecision surface flattening of porous silicon by diamond turning
- (2017) Mehdi Heidari et al. PRECISION ENGINEERING-JOURNAL OF THE INTERNATIONAL SOCIETIES FOR PRECISION ENGINEERING AND NANOTECHNOLOGY
- Fabrication of silicon-based porous nanocomposite films by focused infrared light sintering
- (2016) Jiwang Yan et al. CIRP ANNALS-MANUFACTURING TECHNOLOGY
- Microscale Fracture Behavior of Single Crystal Silicon Beams at Elevated Temperatures
- (2016) Balila Nagamani Jaya et al. NANO LETTERS
- Subsurface damage mechanism of high speed grinding process in single crystal silicon revealed by atomistic simulations
- (2015) Jia Li et al. APPLIED SURFACE SCIENCE
- Molecular dynamics modelling of brittle–ductile cutting mode transition: Case study on silicon carbide
- (2015) Gaobo Xiao et al. INTERNATIONAL JOURNAL OF MACHINE TOOLS & MANUFACTURE
- Diamond machining of silicon: A review of advances in molecular dynamics simulation
- (2015) Saurav Goel et al. INTERNATIONAL JOURNAL OF MACHINE TOOLS & MANUFACTURE
- Brittle versus ductile fracture mechanism transition in amorphous lithiated silicon: From intrinsic nanoscale cavitation to shear banding
- (2015) Bin Ding et al. Nano Energy
- Silicon nanostructures for photonics and photovoltaics
- (2014) Francesco Priolo et al. Nature Nanotechnology
- Laser recovery of machining damage under curved silicon surface
- (2013) Jiwang Yan et al. CIRP ANNALS-MANUFACTURING TECHNOLOGY
- Computational Analysis Methods in Atomistic Modeling of Crystals
- (2013) Alexander Stukowski JOM
- Macroscopic scattering of cracks initiated at single impurity atoms
- (2013) J.R. Kermode et al. Nature Communications
- Analysis of ductile mode and brittle transition of AFM nanomachining of silicon
- (2012) Seoung Hwan Lee INTERNATIONAL JOURNAL OF MACHINE TOOLS & MANUFACTURE
- Very high speed cutting of Ti–6Al–4V titanium alloy – change in morphology and mechanism of chip formation
- (2012) G. Sutter et al. INTERNATIONAL JOURNAL OF MACHINE TOOLS & MANUFACTURE
- Study of Ductile-to-Brittle Transition in Single Grit Diamond Scribing of Silicon: Application to Wire Sawing of Silicon Wafers
- (2012) Hao Wu et al. JOURNAL OF ENGINEERING MATERIALS AND TECHNOLOGY-TRANSACTIONS OF THE ASME
- Patterning by controlled cracking
- (2012) Koo Hyun Nam et al. NATURE
- Wetting transparency of graphene
- (2012) Javad Rafiee et al. NATURE MATERIALS
- Nanometric cutting of single crystal silicon surfaces modified by ion implantation
- (2011) F.Z. Fang et al. CIRP ANNALS-MANUFACTURING TECHNOLOGY
- Nanogrinding of multi-layered thin film amorphous Si solar panels
- (2011) Taro Sumitomo et al. INTERNATIONAL JOURNAL OF MACHINE TOOLS & MANUFACTURE
- Deformation and material removal in a nanoscale multi-layer thin film solar panel using nanoscratch
- (2010) Taro Sumitomo et al. INTERNATIONAL JOURNAL OF MACHINE TOOLS & MANUFACTURE
- Substrate-enhanced supercooling in AuSi eutectic droplets
- (2010) T. U. Schülli et al. NATURE
- The Near-Tip Fields of Fast Cracks
- (2010) A. Livne et al. SCIENCE
- Low-speed fracture instabilities in a brittle crystal
- (2008) J. R. Kermode et al. NATURE
- A different type of indentation size effect
- (2008) S. Shim et al. SCRIPTA MATERIALIA
Add your recorded webinar
Do you already have a recorded webinar? Grow your audience and get more views by easily listing your recording on Peeref.
Upload NowBecome a Peeref-certified reviewer
The Peeref Institute provides free reviewer training that teaches the core competencies of the academic peer review process.
Get Started