Kinematic Optimization for Chemical Mechanical Polishing Based On Statistical Analysis of Particle Trajectories

标题
Kinematic Optimization for Chemical Mechanical Polishing Based On Statistical Analysis of Particle Trajectories
作者
关键词
-
出版物
IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING
Volume 26, Issue 4, Pages 556-563
出版商
Institute of Electrical and Electronics Engineers (IEEE)
发表日期
2013-09-11
DOI
10.1109/tsm.2013.2281218

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