Correlation Between Measurement and Simulation of Thermal Warpage in PBGA With Consideration of Molding Compound Residual Strain

标题
Correlation Between Measurement and Simulation of Thermal Warpage in PBGA With Consideration of Molding Compound Residual Strain
作者
关键词
-
出版物
出版商
Institute of Electrical and Electronics Engineers (IEEE)
发表日期
2008-09-10
DOI
10.1109/tcapt.2008.2001168

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