Article
Materials Science, Multidisciplinary
D. Zhou, A. S. M. A. Haseeb, A. Andriyana
Summary: This study investigates the effects of simultaneous additions of Bi, Sb and Ni to SAC 305 solder on the evolution of microstructure and mechanical properties of the solder under thermal aging. The results show that the multicomponent alloy has superior microstructural stability and improved mechanical strength at long aging time.
MATERIALS TODAY COMMUNICATIONS
(2022)
Article
Engineering, Electrical & Electronic
Marion Branch Kelly, Aravindha Antoniswamy, Ravi Mahajan, Nikhilesh Chawla
Summary: The addition of Indium has shown promise as an alloying element in Sn-rich solders, impacting melting temperature and microstructure. While its effect on microstructure under certain conditions is still not fully understood, Indium has been observed to slow intermetallic growth in electromigration testing and form nanoparticles in the solder matrix.
JOURNAL OF ELECTRONIC MATERIALS
(2021)
Review
Engineering, Mechanical
Emmanuel R. Arriola, Aristotle T. Ubando, Jeremias A. Gonzaga, Chang-Chun Lee
Summary: With the increasing popularity of wearable devices and micro-electromechanical systems, smaller and thinner electronic devices are becoming more prevalent in the market. These devices utilize advanced components like 3D semiconductor packages designed specifically for smaller applications. One such package is the wafer-level chip-scale package, known for its size efficiency. However, the smaller and thinner form factor of these packages also raises concerns about solder reliability. This review focuses on the latest trends in solder joint technology for wafer-level chip-scale packages, analyzing publications on design guidelines, innovation, and prediction models.
ENGINEERING FAILURE ANALYSIS
(2023)
Article
Materials Science, Multidisciplinary
A. M. El-Taher, A. F. Razzk
Summary: The addition of Fe, Co, Te, and Bi alloying elements can effectively transform large platelets of Ag3Sn IMCs into fine needle-like morphology, forming new IMCs and Bi particles that provide more obstacles to hinder dislocation movement, thereby significantly increasing the alloy's creep resistance and fracture lifetime.
METALS AND MATERIALS INTERNATIONAL
(2021)
Article
Engineering, Manufacturing
Mathias Ekpu
Summary: The study focused on the reliability of SAC405 and SAC396 in microelectronics assembly, using them as TIMs. Through finite element analysis, it was found that SAC405 is more reliable than SAC396, with a predicted fatigue life of 85 days compared to 13 days. Manufacturers can use this information to guide their selection of solder TIMs in electronic product assembly.
SOLDERING & SURFACE MOUNT TECHNOLOGY
(2021)
Article
Materials Science, Multidisciplinary
Umair Ali, Hamza Khan, Muhammad Aamir, Khaled Giasin, Numan Habib, Muhammad Owais Awan
Summary: This study found that doping Bismuth into SAC305 can effectively refine microstructure, suppress the growth of intermetallic compounds, and improve mechanical properties. The best performance was observed with 3% Bismuth doping, which also resulted in a decrease in the melting temperature.
Article
Engineering, Electrical & Electronic
Vikrant Singh, Dileep Pathote, Dheeraj Jaiswal, M. R. Kumar, Kamalesh K. Singh, C. K. Behera
Summary: Predicting the thermodynamic behavior of higher-order multicomponent alloys is crucial but challenging. In this study, the thermodynamic data of the Sn-Bi-Sb system, which is a lead-free solder ternary system, was assessed. The integral and partial mixing enthalpies were determined using a drop-solution calorimeter. The mixing enthalpies were found to be temperature-independent, and the interaction parameter was derived based on the ternary enthalpy values using the Redlich-Kister-Muggianu model.
JOURNAL OF ELECTRONIC MATERIALS
(2023)
Article
Metallurgy & Metallurgical Engineering
Jie Wu, Guo-qiang Huang, Song-bai Xue, Peng Xue, Yong Xu
Summary: The effects of adding trace amounts of Al2O3 nanoparticles on the thermal reliabilities of Sn-0.5Ag-0.7Cu/Cu solder joints were investigated. The results showed that the addition of Al2O3 nanoparticles increased the lifespan of the joints under isothermal aging and thermal cyclic conditions. The nanoparticles also slowed down the reduction of shear force during thermal services, which was due to their pinning effect on hindering the growth of grains and interfacial intermetallic compounds.
TRANSACTIONS OF NONFERROUS METALS SOCIETY OF CHINA
(2022)
Article
Materials Science, Multidisciplinary
Preeth Sivakumar, Kathy O'Donnell, Junghyun Cho
Summary: The study investigates the effects of Bi and Ni on the growth kinetics of interfacial IMCs and mechanical strength of SAC solder balls during high temperature aging. Addition of Bi increased hardness and resistance to age softening, while Ni slowed down the consumption of the Cu layer and limited the growth of Cu3Sn layer during aging. The presence of Bi and Ni shows the potential to improve the reliability of SAC solder ball joint by restricting solder deformation and Cu3Sn layer growth during aging.
MATERIALS TODAY COMMUNICATIONS
(2021)
Article
Engineering, Electrical & Electronic
Rebecca Wheeling, Paul Vianco, Shelley Williams, Luis Jauregui, Dorina F. Sava Gallis
Summary: This study fills the knowledge gap in solder joint gold embrittlement through investigating the impact of Au layer thickness on the mechanical performance of solder joints. The findings reveal the influence of Au content on the mechanical strength of joints and its primary mechanism.
JOURNAL OF ELECTRONIC MATERIALS
(2022)
Article
Computer Science, Information Systems
Luchun Yan, Jiawen Yao, Yu Dai, Shanshan Zhang, Wangmin Bai, Kewei Gao, Huisheng Yang, Yanbin Wang
Summary: This study investigates the influence of different materials in a die-attach structure on the stress at the chip-solder interface. The results show that the CTE mismatch between the solder and other materials not only affects the maximum stress at the chip-solder interface, but also causes stress recovery peaks.
Article
Chemistry, Physical
Michal Skarba, Marcela Pekarcikova, Lubomir Frolek, Eva Cuninkova, Martin Necpal
Summary: Overlap soldered joints of high-temperature superconducting tapes were prepared using various materials and preparation conditions, with the quality of internal interfaces playing a dominant role in joint resistivity and critical current. Reliable joints can be prepared within the limit of 100 thermal cycles, with normalized resistivity not exceeding 1.4 and normalized critical current above 0.85.
Article
Physics, Applied
Canan Aksoy, Bakiye Cakir, Ezgi Taylan Koparan, Cemaleddin Simsek, Engin Tirasoglu, Susannah Speller, Chris R. M. Grovenor, Tevfik Kucukomeroglu, Ekrem Yanmaz
Summary: Researchers have found that adding materials such as Pb, Nb, AgCu and graphene nano pellets into SnIn (35:65) can enhance its superconducting properties. Even low Pb additions show a dramatic improvement in superconducting properties and could potentially replace commonly used PbBi solder with better results.
SUPERCONDUCTOR SCIENCE & TECHNOLOGY
(2023)
Article
Materials Science, Multidisciplinary
Monalisa Char, Amit K. Chakraborty, Arnab S. Bhattacharyya, Abhijit Kar
Summary: The use of sandwich-stacked Sn/SAC305/Sn multilayers in Cu-Sn/SAC305/Sn-Cu solder joints improves micromechanical and electrical properties compared to Cu-SAC305-Cu joints. Sn multilayers facilitate the formation of more evenly distributed intermetallic compounds and higher dislocation densities. Additionally, the Sn multilayer solder joints exhibit better hardness, modulus, resistance to plastic deformation, electron transfer capacity, and resistance to humidity compared to nonlayered solder joints.
ADVANCED ENGINEERING MATERIALS
(2022)
Article
Engineering, Electrical & Electronic
Sh. E. Abd El Hamid, El Said Gouda, Nabil A. Abdel Ghany
Summary: The influence of Bi and Al alloying on the corrosion performance of Sn-9Zn was examined. The presence of Bi increased the corrosion resistance and formed an anodic barrier on the alloy surface. The addition of Bi and Al also improved the hardness and melting temperature characteristics of the solder alloy.
MICROELECTRONICS RELIABILITY
(2023)
Article
Engineering, Manufacturing
David De Baere, Pierre Van Cauwenbergh, Mohamad Bayat, Sankhya Mohanty, Jesper Thorborg, Lore Thijs, Brecht Van Hooreweder, Kim Vanmeensel, Jesper H. Hattel
Summary: This study investigates the effect of stress relief heat treatment in laser-based powder bed fusion post-processing, modeling the impact of post-processing parameters on residual stress. The results show that heat treatment can alleviate residual stress in parts, allowing for the selection of optimal heat treatment conditions based on simulation results and reducing the need for extensive experimentation.
ADDITIVE MANUFACTURING
(2021)
Article
Materials Science, Composites
Filip B. Salling, Niels Jeppesen, Mads R. Sonne, Jesper H. Hattel, Lars P. Mikkelsen
Summary: This study introduces a holistic segmentation procedure for obtaining individual fiber inclination angles from X-ray computed tomography, successfully applied to both unidirectional and air-textured glass fiber-reinforced composite profiles. The results show accurate and automated inclination estimates with no notable deviation when compared to results from structure tensor analysis.
JOURNAL OF COMPOSITE MATERIALS
(2022)
Article
Materials Science, Multidisciplinary
Alexandra Fedoseeva, Ivan Nikitin, Nadezhda Dudova, John Hald, Rustam Kaibyshev
Summary: This paper presents the experimental results of thermo-mechanical processing on a 12% Cr steel, which resulted in increased impact toughness and decreased ductile-brittle transition temperature. The study also observed changes in the interfaces and carbides between different phases.
Article
Engineering, Manufacturing
David De Baere, Mandana Moshiri, Lukasz Smolej, Jesper H. Hattel
Summary: The laser-based powder bed fusion of 300-grade maraging steel enables the production of highly durable parts, improving the lifespan and wear resistance of tooling or mould inserts. The transformation from austenite to martensite in this material is linked to compressive stresses at the surface, causing the opposite bending direction after cutting compared to other materials. Numerical simulations and adjustments in laser power revealed the significant influence of the laser absorption coefficient on post-cutting deformation.
ADDITIVE MANUFACTURING
(2022)
Article
Engineering, Manufacturing
Amal Charles, Mohamad Bayat, Ahmed Elkaseer, Lore Thijs, Jesper Henri Hattel, Steffen Scholz
Summary: This study fundamentally elucidates the driving phenomenon behind dross formation in metallic component printing using Laser Powder Bed Fusion (L-PBF), and explains the reasons for the differences in dross domain size with high and low laser energy densities. Additionally, the study explains the observed deep internal grooves and near-surface porosity within the dross domain, which can affect mechanical properties.
ADDITIVE MANUFACTURING
(2022)
Review
Engineering, Multidisciplinary
Maximilian Volk, Onur Yuksel, Ismet Baran, Jesper H. Hattel, Jon Spangenberg, Michael Sandberg
Summary: This paper reviews the importance and applications of pultrusion technology in composite material manufacturing, and discusses its role and potential in additive manufacturing and sustainable composite manufacturing.
COMPOSITES PART B-ENGINEERING
(2022)
Article
Multidisciplinary Sciences
Jingqi Zhang, Yingang Liu, Gang Sha, Shenbao Jin, Ziyong Hou, Mohamad Bayat, Nan Yang, Qiyang Tan, Yu Yin, Shiyang Liu, Jesper Henri Hattel, Matthew Dargusch, Xiaoxu Huang, Ming-Xing Zhang
Summary: This study develops a new titanium alloy with uniform mechanical properties through rational alloy design, addressing the spatially dependent microstructures and mechanical properties of additively manufactured titanium alloys.
NATURE COMMUNICATIONS
(2022)
Article
Mechanics
Zygimantas Staliulionis, Gintautas Miliauskas, Sankhya Mohanty, Jesper Henri Hattel
Summary: This paper investigates the heat and mass transfer processes between two connected enclosures and develops a code model to predict and study the temperature and moisture behavior. The modeling is done using one-dimensional finite volume techniques and lumped analysis methods under non-isothermal conditions.
Article
Automation & Control Systems
Erik Holmen Olofsson, Michael Roland, Jon Spangenberg, Ninna Halberg Jokil, Jesper Henri Hattel
Summary: Mixing in extrusion is crucial for achieving consistent and high-quality extrudates, and residence time is a key measure of mixing performance. This study introduces a new CFD model that characterizes the extruder fill length and residence time distribution in a starve-fed extruder, including free surface tracking. The model is validated through laboratory tests and shows the impact of considering the partially filled extruder, rather than assuming it to be flooded, on residence time distribution. The results demonstrate the ability to fit simulation results to simpler analytical models, highlighting the importance of including the entire extrusion system for accurate predictions in starve-fed extrusion systems.
INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY
(2023)
Article
Thermodynamics
Alberto Santi, Mohamad Bayat, Jesper Hattel
Summary: Metal additive manufacturing (MAM) has seen significant growth in production performance and knowledge, but production defects are still a challenge due to the temperature development and residual stresses during printing. This study describes the modeling techniques of MAM, with a focus on thermomechanical modeling. Flash Heating (FH) and Sequential Flash Heating (SFH) methods show promise in providing reliable results in a short simulation time. Four case studies are presented and validated, and it is envisioned that FH and SFH methods can be part of a multi-scale, multi-physics modeling framework.
JOURNAL OF THERMAL STRESSES
(2023)
Article
Engineering, Chemical
Michael Sandberg, Jesper H. Hattel, Jon Spangenberg
Summary: Resin-injection pultrusion (RIP) utilizes high resin pressure for fast resin impregnation. Understanding flow-induced fiber compaction is important due to deformation caused by the injection process. This paper presents a numerical framework analyzing flow-induced fiber compaction and its effects on non-isothermal material flow in an industrial RIP process, with the result showing reduced flow resistance and improved resin impregnation due to fiber compaction. The research also highlights the influence of other factors such as fiber volume fraction and resin viscosity on the process.
TRANSPORT IN POROUS MEDIA
(2023)
Article
Chemistry, Multidisciplinary
Alireza Mollaei Ardestani, Ghasem Azamirad, Yasin Shokrollahi, Matteo Calaon, Jesper Henri Hattel, Murat Kulahci, Roya Soltani, Guido Tosello
Summary: Injection molding is a crucial process for mass production of plastic parts. Researchers have been focusing on predicting defects and optimizing process parameters to avoid them. Blush, a common defect near the gate, was studied in this research. Design of experiments, finite element analysis, and ANOVA were used to investigate eight design parameters with impact on blush formation. Machine learning methods including artificial neural networks, their combination with genetic algorithms, and particle swarm optimization were applied for efficient predictive modeling. Among them, basic artificial neural network achieved the closest predictions with an average accuracy error of 1.3%. ANOVA and genetic algorithm were utilized for process parameter optimization, resulting in significant reduction of blush defect area.
APPLIED SCIENCES-BASEL
(2023)
Article
Engineering, Manufacturing
W. E. Alphonso, M. Baier, S. Carmignato, J. H. Hattel, M. Bayat
Summary: Meso-scale, multi-physics simulations of metal additive manufacturing (MAM) processes are used to study the impacts of material/process-related uncertainties on the heat transfer conditions within the melt pool. The study investigates the effects of recoil pressure at different laser linear energy densities (LED) and laser beam sizes, as well as the influence of different capillary forces on the melt pool shape and size. The findings indicate a threshold LED below which the melt pool shape is not affected by the recoil pressure and is governed by the Marangoni effect.
JOURNAL OF MANUFACTURING PROCESSES
(2023)
Proceedings Paper
Polymer Science
Michael Roland Larsen, Simone Christensen, Inge Aagaard, Adrian Defante, Tobias Ottsen, Jesper Henri Hattel, Jon Spangenberg
Summary: In this paper, a Taguchi DOE is conducted to study the homogeneity of adhesive materials using a pilot-scale twin-sigma-blade mixer. The results indicate that purifying the particles has a significant positive impact on the homogeneity of the adhesive barriers.
PROCEEDINGS OF THE 36TH CONFERENCE OF THE POLYMER PROCESSING SOCIETY, PPS36
(2023)
Proceedings Paper
Computer Science, Artificial Intelligence
Zygimantas Staliulionis, Sankhya Mohanty, Jesper Henri Hattel, Gintautas Miliauskas
Summary: This study focuses on the humidity-related failure modes of electronic devices exposed to harsh climate conditions and the transport behavior of humidity and temperature. Numerical modeling and prediction methods are used to postpone failures and prolong the lifetime of electronic devices.
PROCEEDINGS OF 26TH INTERNATIONAL CONFERENCE ELECTRONICS 2022
(2022)
Article
Engineering, Electrical & Electronic
Bruno Galizia, Patrick Fiorenza, Corrado Bongiorno, Bela Pecz, Zsolt Fogarassy, Emanuela Schiliro, Filippo Giannazzo, Fabrizio Roccaforte, Raffaella Lo Nigro
Summary: This study demonstrates the growth of oriented AlN thin films on 4H-SiC substrates using PE-ALD technique, and investigates the impact of NH3 plasma pulsing on the microstructure and orientation degree of the AlN layers. The structural characterization reveals different polymorphic structures depending on the NH3 plasma pulsing time, and electrical nanoscopic characterization shows a correlation between the AlN crystalline phases and the insulating properties.
MICROELECTRONIC ENGINEERING
(2024)
Article
Engineering, Electrical & Electronic
Theo Levert, Alter Zakhtser, Julien Duval, Chloe Raguenez, Stephane Verdier, Delphine Le Cunff, Jean-Herve Tortai, Bernard Pelissier
Summary: In this study, the robustness of optical constants and optical band gap determination of three different materials is compared using a combination of spectroscopic ellipsometry and energy loss signal of X-ray photoelectron spectroscopy. The hybridization of these two techniques provides a new robust method for determining the band gap of the studied materials and other optical properties over a wide energy range.
MICROELECTRONIC ENGINEERING
(2024)
